W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 51
W25Q16BVSFIG
Manufacturer Part Number
W25Q16BVSFIG
Description
IC SPI FLASH 16MBIT 16SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q16BVSFIG.pdf
(68 pages)
Specifications of W25Q16BVSFIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
16M (2M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
16-SOIC (0.300", 7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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11.2.31 Read JEDEC ID (9Fh)
For compatibility reasons, the W25Q16BV provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin
low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh)
and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the
falling edge of CLK with most significant bit (MSB) first as shown in figure 30. For memory type and
capacity values refer to Manufacturer and Device Identification table.
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Figure 30. Read JEDEC ID Instruction Sequence Diagram
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Publication Release Date: July 08, 2010
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W25Q16BV
Revision F
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