W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 60
W25Q16BVSFIG
Manufacturer Part Number
W25Q16BVSFIG
Description
IC SPI FLASH 16MBIT 16SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q16BVSFIG.pdf
(68 pages)
Specifications of W25Q16BVSFIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
16M (2M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
16-SOIC (0.300", 7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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13.
13.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
SEATING PLANE
SEATING PLANE
PACKAGE SPECIFICATION
Y
Y
SYMBOL
8
8
1
1
D
E
Y
A1
e
H
A
θ
b
L
c
(2)
(4)
(3)
(3)
E
b
b b b
D
D
Min
1.35
0.10
0.33
0.19
3.80
4.80
5.80
0.40
---
0°
MILLIMETERS
e
e
1.27 BSC
5
5
4
4
A1
A1
Max
E H
E H
E H
1.75
0.25
0.51
0.25
4.00
5.00
6.20
0.10
1.27
A
A
10°
- 60 -
E
E
E
0.053
0.004
0.013
0.008
0.150
0.188
0.228
0.016
Min
---
0°
INCHES
0.050 BSC
0.069
0.010
0.020
0.010
0.157
0.196
0.244
0.004
0.050
Max
0.25
0.25
10°
W25Q16BV
GAUGE PLANE
GAUGE PLANE
c
c
L
L
θ
θ
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