W25Q16BVSSIG Winbond Electronics, W25Q16BVSSIG Datasheet - Page 47
W25Q16BVSSIG
Manufacturer Part Number
W25Q16BVSSIG
Description
IC SPI FLASH 16MBIT 8SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q16BVSFIG.pdf
(68 pages)
Specifications of W25Q16BVSSIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
16M (2M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
W25Q16BVSSIG
Manufacturer:
WINBOND
Quantity:
9 270
Company:
Part Number:
W25Q16BVSSIG
Manufacturer:
WINBOND
Quantity:
20 655
Part Number:
W25Q16BVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
W25Q16BV
11.2.27 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in figure 26. The Device ID values for the W25Q16BV is listed in Manufacturer and Device Identification
table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to
the other. The instruction is completed by driving /CS high.
31 32
33 34 35 36 37 38 39
40 41 42 43 44
45 46
Figure 26. Read Manufacturer / Device ID Instruction Sequence Diagram
Publication Release Date: July 08, 2010
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Revision F