CY7C1363C-133AXC Cypress Semiconductor Corp, CY7C1363C-133AXC Datasheet - Page 22

IC SRAM 9MBIT 133MHZ 100LQFP

CY7C1363C-133AXC

Manufacturer Part Number
CY7C1363C-133AXC
Description
IC SRAM 9MBIT 133MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1363C-133AXC

Memory Size
9M (512K x 18)
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Speed
133MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Memory Configuration
512K X 18 / 256K X 36
Clock Frequency
133MHz
Access Time
6.5ns
Supply Voltage Range
3.135V To 3.6V
Memory Case Style
TQFP
No. Of Pins
100
Density
9Mb
Access Time (max)
6.5ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
133MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
19b
Package Type
TQFP
Operating Temp Range
0C to 70C
Number Of Ports
2
Supply Current
250mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
100
Word Size
18b
Number Of Words
512K
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-2131
CY7C1363C-133AXC

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1363C-133AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1363C-133AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Electrical Characteristics
Over the Operating Range (continued)
Capacitance
Thermal Resistance
Note
Document Number: 38-05541 Rev. *J
I
I
I
I
I
C
C
C
18. Tested initially and after any design or process change that may affect these parameters.
DD
SB1
SB2
SB3
SB4
Parameter
Parameter
Parameter
IN
CLK
I/O
OUTPUT
OUTPUT
JA
JC
3.3 V I/O Test Load
2.5 V I/O Test Load
Input capacitance
Clock input capacitance
Input/output capacitance
V
current
Automatic CE
power-down
current—TTL inputs
Automatic CE
power-down
Current—CMOS inputs
Automatic CE
power-down
current—CMOS inputs
Automatic CE
power-down
current—TTL inputs
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
DD
Z
Z
0
0
[18]
operating supply
= 50 
= 50 
Description
Description
Description
(a)
(a)
V
V
T
T
= 1.25 V
[18]
= 1.5 V
R
R
L
L
= 50 
= 50 
[16, 17]
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
according to EIA/JESD51
V
f = f
Max V
V
inputs switching
Max V
V
f = 0, inputs static
Max V
V
f = f
Max V
V
f = 0, inputs static
OUTPUT
OUTPUT
3.3 V
2.5 V
DD
IN
IN
IN
IN
Figure 5. AC Test Loads and Waveforms
INCLUDING
> V
> V
MAX
> V
MAX
> V
= Max, I
INCLUDING
JIG AND
T
SCOPE
DD
DD
DD
DD
A
IH
DDQ
DD
IH
JIG AND
, inputs switching
Test Conditions
Test Conditions
= 25 C, f = 1 MHz,
= 1/t
SCOPE
, device deselected,
, device deselected,
, device deselected,
, device deselected,
or V
V
or V
V
– 0.3 V or V
5 pF
5 pF
DDQ
– 0.3 V or V
DD
OUT
CYC
IN
IN
= 3.3 V
< V
= 2.5 V
< V
= 0 mA,
IL
(b)
(b)
IL
R = 317 
R = 1667 
, f = f
Test Conditions
IN
IN
< 0.3 V,
< 0.3 V,
MAX,
R = 351 
R = 1538 
All speeds
(Commercial/Industrial)
(Automotive)
All speeds
All speeds
(Commercial/Industrial)
(Automotive)
All speeds
(Commercial/Industrial)
(Automotive)
7.5 ns cycle,133 MHz
10 ns cycle,100 MHz
10 ns cycle,100 MHz
10 ns cycle,100 MHz
10 ns cycle,100 MHz
100 TQFP
100 TQFP
Package
29.41
V
6.31
Max
GND
GND
V
DDQ
5
5
5
DDQ
 1 ns
 1 ns
10%
10%
119 BGA
119 BGA
Package
Max
CY7C1361C/CY7C1363C
34.1
14.0
5
5
7
ALL INPUT PULSES
ALL INPUT PULSES
90%
90%
165 FBGA
165 FBGA
Package
Max
16.8
(c)
(c)
3.0
5
5
7
Min
°C/W
°C/W
Unit
90%
90%
Unit
pF
pF
pF
Max
250
180
150
100
120
110
10%
10%
40
40
60
Page 22 of 34
 1 ns
 1 ns
Unit
mA
mA
mA
mA
mA
mA
mA
mA
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