DS2433+ Maxim Integrated Products, DS2433+ Datasheet - Page 23

• Manufacturer Part Number: DS2433+
• Description: IC EEPROM 4KBIT TO92-3
• Manufacturer: Maxim Integrated Products

Specifications of DS2433+

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 4K (256 x 16)
• Interface: 1-Wire Serial
• Operating Temperature: -40°C ~ 85°C
• Package / Case: TO-92-3 (Long Body), TO-226
• Organization: 4 K x 1
• Interface Type: 1-Wire
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2.8 V
• Maximum Operating Current: 500 uA
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Speed: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

REVISION HISTORY
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
M a x i m I n t e g r a t e d P r o d u c t s , 1 2 0 S a n G a b r i e l D r i v e , S u n n y v a l e , C A 9 4 0 8 6 4 0 8 - 7 3 7 - 7 6 0 0
REVISION
The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.
DATE
10/10
3/07
3/08
5/08
Added the flip chip package (Features, Ordering Information, Pin
Assignment), changing name from chip scale package; added SFN package
to Ordering Information/Features; updated Ordering Information with lead-
free packages.
In Figure 5, changed “32-BIT INTERMEDIATE STORAGE
SCRATCHPAD” TO “32-BYTE INTERMEDIATE STORAGE
SCRATCHPAD.”
In the SFN pin configuration, added information that the package is
qualified for electro-mechanical contact applications only, not for
soldering, and added reference to Application Note 4132.
In the Absolute Maximum Ratings section, removed the “A” from the
soldering temperature specification.
Added Package Information table.
In the Ordering Information table, removed the leaded parts for the PR-35
and SO packages and changed the flip chip packages from standard to
RoHS compliant.
In the flip chip pin configuration, changed the revision code format from
“rrr” to “rr.”
Corrected the clearing of PF, AA flags in the Write Scratchpad flow
Updated soldering temperatures, relocated V
EC-table DC section, changed V
from the EC table, renumbered the EC table notes.
Changed SOIC package code from W8+3 to W8+2, corrected SFN package
code (was G266+1), added land pattern information.
© 2010 Maxim Integrated Products
DESCRIPTION
ILMAX
23 of 23
from 0.8V to 0.5V, deleted V
PUP
from EC-table header to
OH
CHANGED
PAGES
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22
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