W25X40BVDAIG Winbond Electronics, W25X40BVDAIG Datasheet - Page 45

• Manufacturer Part Number: W25X40BVDAIG
• Description: IC SPI FLASH 4MBIT 8PDIP
• Manufacturer: Winbond Electronics

Specifications of W25X40BVDAIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11.2 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches
SYMBOL
D1
A1
A2
E1
A
C
D
H
b
E
e
L
y
θ
MIN
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
0°
-
MILLIMETERS
1.27 BSC
NOM
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
-
-
0.010
MAX
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
- 45 -
8°
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
MIN
W25X10BV/20BV/40BV
0°
-
Publication Release Date: August 20, 2009
0.050 BSC
INCHES
.
NOM
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
-
-
Preliminary -- Revision B
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
MAX
8°