W25X40BVDAIG Winbond Electronics, W25X40BVDAIG Datasheet - Page 5

• Manufacturer Part Number: W25X40BVDAIG
• Description: IC SPI FLASH 4MBIT 8PDIP
• Manufacturer: Winbond Electronics

Specifications of W25X40BVDAIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

W25X10BV/20BV/40BV
3. PIN CONFIGURATION SOIC 150-MIL / 208-MIL
Figure 1a. W25X10BV/20BV/40BV Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS)
4. PAD CONFIGURATION WSON 6X5-MM
Figure 1b. W25X10BV/20BV/40BV Pad Assignments, 8-pad WSON 6X5-mm (Package Code ZP)
Publication Release Date: August 20, 2009
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Preliminary -- Revision B