W25X40BVDAIG Winbond Electronics, W25X40BVDAIG Datasheet - Page 48

• Manufacturer Part Number: W25X40BVDAIG
• Description: IC SPI FLASH 4MBIT 8PDIP
• Manufacturer: Winbond Electronics

Specifications of W25X40BVDAIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8-Pad WSON 6x5mm Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
SOLDER PATTERN
exposed PCB vias under the pad.
SYMBOL
M
Q
N
P
R
MIN
MILLIMETERS
TYP.
3.40
4.30
6.00
0.50
0.75
MAX
- 48 -
MIN
W25X10BV/20BV/40BV
INCHES
0.
0.
0.
0.
0.
TYP
13
16
23
01
02
38
92
60
96
55
.
MAX