CY14E256L-SZ45XC Cypress Semiconductor Corp, CY14E256L-SZ45XC Datasheet - Page 6

IC NVSRAM 256KBIT 45NS 32SOIC

CY14E256L-SZ45XC

Manufacturer Part Number
CY14E256L-SZ45XC
Description
IC NVSRAM 256KBIT 45NS 32SOIC
Manufacturer
Cypress Semiconductor Corp
Type
NVSRAMr
Datasheet

Specifications of CY14E256L-SZ45XC

Format - Memory
RAM
Memory Type
NVSRAM (Non-Volatile SRAM)
Memory Size
256K (32K x 8)
Speed
45ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Package / Case
32-SOIC (7.5mm Width)
Word Size
8b
Organization
32Kx8
Density
256Kb
Interface Type
Parallel
Access Time (max)
45ns
Operating Supply Voltage (typ)
5V
Package Type
SOIC
Operating Temperature Classification
Commercial
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Operating Temp Range
0C to 70C
Pin Count
32
Mounting
Surface Mount
Supply Current
70mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY14E256L-SZ45XC
Manufacturer:
CYPRESS
Quantity:
1 167
Part Number:
CY14E256L-SZ45XCT
Manufacturer:
CYPRESS
Quantity:
3 020
Data Protection
The CY14E256L protects data from corruption during low
voltage conditions by inhibiting all externally initiated STORE
and WRITE operations. The low voltage condition is detected
when V
mode (both CE and WE are low) at power up after a RECALL or
after a STORE, the WRITE is inhibited until a negative transition
on CE or WE is detected. This protects against inadvertent writes
during power up or brown out conditions.
Noise Considerations
The CY14E256L is a high speed memory. It must have a high
frequency bypass capacitor of approximately 0.1 µF connected
between V
as possible. As with all high speed CMOS ICs, careful routing of
power, ground, and signals reduce circuit noise.
Hardware Protect
The CY14E256L offers hardware protection against inadvertent
STORE operation and SRAM WRITEs during low voltage condi-
tions. When V
operations and SRAM WRITEs are inhibited. AutoStore can be
completely disabled by tying VCC to ground and applying + 5V
to V
STOREs are only initiated by explicit request using either the
software sequence or the HSB pin.
Low Average Active Power
CMOS technology provides the CY14E256L the benefit of
drawing significantly less current when it is cycled at times longer
than 50 ns.
READ or WRITE cycle time. Worst case current consumption is
shown for both CMOS and TTL input levels (commercial temper-
ature range, VCC = 5.5V, 100% duty cycle on chip enable). Only
standby current is drawn when the chip is disabled. The overall
average current drawn by the CY14E256L depends on the
following items:
Document Number: 001-06968 Rev. *H
The duty cycle of chip enable
The overall cycle rate for accesses
The ratio of READs to WRITEs
CMOS versus TTL input levels
The operating temperature
The V
I/O loading
CAP
CC
. This is the AutoStore Inhibit mode; in this mode,
CC
is less than V
CC
level
Figure 4
and V
CAP
<V
SS,
shows the relationship between I
SWITCH
using leads and traces that are as short
SWITCH
, all externally initiated STORE
. If the CY14E256L is in a WRITE
CC
and
Figure 4. Current Versus Cycle Time (READ)
Figure 5. Current Versus Cycle Time (WRITE)
Preventing Store
The STORE function is disabled by holding HSB high with a
driver capable of sourcing 30 mA at a V
because it has to overpower the internal pull down device. This
device drives HSB LOW for 20 μs at the onset of a STORE.
When the CY14E256L is connected for AutoStore operation
(system V
and V
attempts to pull HSB LOW. If HSB does not actually get below
V
attempt.
IL
, the part stops trying to pull HSB LOW and abort the STORE
CC
crosses V
CC
connected to V
SWITCH
on the way down, the CY14E256L
CC
and a 68 μF capacitor on V
OH
CY14E256L
of at least 2.2V,
Page 6 of 19
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