PESD1LIN,135 NXP Semiconductors, PESD1LIN,135 Datasheet

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PESD1LIN LIN-bus ESD protection diode Rev. 3 — 31 May 2011 1. Product profile 1.1 General description PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plastic package designed to protect one automotive Local Interconnect Network (LIN) bus line ...

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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number Package PESD1LIN 4. Marking Table 4. Type number PESD1LIN 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol amb T stg Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. ...

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... NXP Semiconductors Table 6. Symbol V ESD [1] Device stressed with ten non-repetitive ESD pulses. Table 7. Standard IEC 61000-4-2; level 4 (ESD) MIL-STD-883; class 3 (human body model) 120 ; 8 μs 100 % (%) 80 − 8/20 s pulse waveform according to Fig 1. IEC 61000-4-5 PESD1LIN Product data sheet ...

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... NXP Semiconductors 6. Characteristics Table amb Symbol V RWM dif Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4- C T amb Fig 3. Peak pulse power as a function of exponential pulse duration; typical values ...

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... NXP Semiconductors ESD TESTER IEC 61000-4-2 network = 330 Ω 150 pF GND unclamped +1 kV ESD voltage waveform (IEC 61000-4-2 network) GND unclamped −1 kV ESD voltage waveform (IEC 61000-4-2 network) Fig 5. ESD clamping test setup and waveforms PESD1LIN Product data sheet RG 223/U 50 Ω ...

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... NXP Semiconductors 7. Application information The PESD1LIN is designed for the protection of one LIN-bus signal line from the damage caused by ESD and surge pulses. The PESD1LIN provides a surge capability 160 W per line for a 8/20 s waveform. Fig 6. Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients ...

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... NXP Semiconductors 9. Package outline Fig 7. 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PESD1LIN [1] For further information and the availability of packing methods, see PESD1LIN Product data sheet 1.35 1.15 2.7 1.8 2.3 1.6 Dimensions in mm ...

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... NXP Semiconductors 11. Soldering 1.65 Fig 8. 2.75 Fig 9. PESD1LIN Product data sheet 3.05 2.1 0.95 2.2 0.5 (2×) 0.6 (2×) Reflow soldering footprint SOD323 (SC-76) 5 2.9 1.5 (2×) 1.2 (2×) Wave soldering footprint SOD323 (SC-76) All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 May 2011 PESD1LIN LIN-bus ESD protection diode solder lands solder resist 0.5 (2× ...

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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date PESD1LIN v.3 20110531 • Modifications: Section 1.2 “Features and • Figure • Section 8 “Test • Section 13 “Legal PESD1LIN v.2 20081112 PESD1LIN v.1 20041026 PESD1LIN Product data sheet Data sheet status Product data sheet benefits”: updated. ...

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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...

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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information . . . . . . . . . . . . . . . . . . . . . 7 11 Soldering ...