BSS192 /T3 NXP Semiconductors, BSS192 /T3 Datasheet - Page 5
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BSS192 /T3
Manufacturer Part Number
BSS192 /T3
Description
MOSFET TAPE13 PWR-MOS
Manufacturer
NXP Semiconductors
Datasheet
1.BSS192_T3.pdf
(12 pages)
Specifications of BSS192 /T3
Product Category
MOSFET
Rohs
yes
Transistor Polarity
P-Channel
Drain-source Breakdown Voltage
240 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
0.2 A
Configuration
Single
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-89
Fall Time
18 ns
Minimum Operating Temperature
- 65 C
Power Dissipation
1000 mW
Rise Time
18 ns
Factory Pack Quantity
4000
Part # Aliases
BSS192,135
Philips Semiconductors
2002 May 22
handbook, halfpage
handbook, halfpage
P-channel enhancement mode
vertical D-MOS transistor
T
(1) V
(2) V
T
(1) V
(2) V
(3) V
Fig.8
j
j
= 25 C.
(mA)
= 25 C.
I D
(A)
10
10
I D
0 8
0 6
0 4
0 2
Fig.6 Output characteristics; typical values.
10
GS
GS
GS
GS
GS
1
0
3
2
0
8
= 10 V.
= 6 V.
= 10 V.
= 5 V.
= 4 V.
Drain current as a function of drain-source
on-state resistance; typical values.
12
5
(1)
16
(3) V
(4) V
(5) V
10
(1)
GS
GS
GS
= 5 V.
= 4 V.
= 3 V.
20
15
24
20
R DSon ( )
(2)
(3)
(4)
(5)
V DS (V)
(2)
(3)
MDA177
MDA179
28
25
5
handbook, halfpage
handbook, halfpage
V
V
Fig.9
k
DS
GSth
=
(A)
1.2
k
1.1
0.9
0.8
0.7
I D
0 8
0 6
0 4
0 2
= 10 V; T
Fig.7 Transfer characteristic; typical values.
------------------------------------- -
V
at I
1
1
0
GSth
V
50
0
GSth
D
Temperature coefficient of gate-source
threshold voltage; typical values.
= 1 mA.
at 25 C
at T
j
= 25 C.
j
2
0
4
50
6
Product specification
100
8
T j (
V GS (V)
BSS192
MDA182
MDA178
o
C)
150
10