IS61C256AL-12TLI ISSI, Integrated Silicon Solution Inc, IS61C256AL-12TLI Datasheet - Page 10

• Manufacturer Part Number: IS61C256AL-12TLI
• Description: IC SRAM 256KBIT 12NS 28TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc
• Type: Asynchronousr

Specifications of IS61C256AL-12TLI

• Memory Size: 256K (32K x 8)
• Package / Case: 28-TSOP
• Interface: Parallel
• Format - Memory: RAM
• Memory Type: SRAM - Asynchronous
• Speed: 12ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Access Time: 12 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Maximum Operating Current: 25 mA
• Organization: 32 K x 8
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Ports: 1
• Operating Supply Voltage: 5 V
• Density: 256Kb
• Access Time (max): 12ns
• Sync/async: Asynchronous
• Architecture: Not Required
• Clock Freq (max): Not RequiredMHz
• Operating Supply Voltage (typ): 5V
• Address Bus: 15b
• Package Type: TSOP-I
• Operating Temp Range: -40C to 85C
• Supply Current: 25mA
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 28
• Word Size: 8b
• Number Of Words: 32K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 706-1031

PACKAGING INFORMATION
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
300-mil Plastic SOJ
Package Code: J
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. D
02/25/03
Sym.
N0.
Leads
A
A1
A2
b
B
C
D
E
E1
E2
e
N
1
e
17.02
Min. Typ. Max.
2.41
0.41
0.66
0.20
8.26
7.49
6.27
0.64
MILLIMETERS
—
1.27 BSC
24/26
—
—
—
—
—
—
—
—
—
—
D
17.27
3.56
2.67
0.51
0.81
0.25
8.76
7.75
7.29
—
b
B
0.025
0.095
0.016
0.026
0.008
0.670
0.325
0.247
Min. Typ. Max.
0.295
—
0.050 BSC
INCHES
A
E1
—
—
—
—
—
—
—
—
A1
— 0.140
—
0.105
0.020
0.032
0.010
0.680
0.345
0.305
0.287
1-800-379-4774
—
E
SEATING PLANE
Notes:
1. Controlling dimension: inches, unless otherwise
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash
4. Formed leads shall be planar with respect to one
specified.
protrusions and
the package
another within 0.004 inches at the seating plane.
E2
.
should be measured from the bottom of
A2
ISSI
C
®