EVAL-ADXL350Z Analog Devices, EVAL-ADXL350Z Datasheet - Page 33

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EVAL-ADXL350Z

Manufacturer Part Number
EVAL-ADXL350Z
Description
Acceleration Sensor Development Tools EB
Manufacturer
Analog Devices
Datasheet

Specifications of EVAL-ADXL350Z

Rohs
yes
Interface Type
I2C, SPI
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Product
Evaluation Boards
Factory Pack Quantity
1
Data Sheet
LAYOUT AND DESIGN RECOMMENDATIONS
Figure 65 shows the recommended printed wiring board land pattern. Figure 66 and Table 22 provide details about the recommended
soldering profile.
Table 22. Recommended Soldering Profile
Profile Feature
Average Ramp Rate from Liquid Temperature (T
Preheat
T
Liquid Temperature (T
Time Maintained Above T
Peak Temperature (T
Time of Actual T
Ramp-Down Rate
Time 25°C to Peak Temperature
1
2
Based on JEDEC Standard J-STD-020D.1.
For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.
SMAX
Minimum Temperature (T
Maximum Temperature (T
Time from T
to T
L
Ramp-Up Rate
SMIN
P
− 5°C (t
to T
P
)
SMAX
L
)
L
P
(t
)
(t
L
S
)
SMIN
)
SMAX
)
)
T
T
P
L
T
SMIN
0.5mm
Figure 65. Recommended Printed Wiring Board Land Pattern
T
1, 2
SMAX
L
) to Peak Temperature (T
Figure 66. Recommended Soldering Profile
PREHEAT
(Dimensions shown in millimeters)
t
25°C TO PEAK
t
S
Rev. 0 | Page 33 of 36
RAMP-UP
3.53mm
0.3mm
TIME
P
)
RAMP-DOWN
0.8mm
t
P
t
L
CRITICAL ZONE
Sn63/Pb37
3°C/sec max
100°C
150°C
60 sec to 120 sec
3°C/sec max
183°C
60 sec to 150 sec
240 + 0/−5°C
10 sec to 30 sec
6°C/sec max
6 minutes max
3.35mm
T
L
TO T
P
Condition
Pb-Free
3°C/sec max
150°C
200°C
60 sec to 180 sec
3°C/sec max
217°C
60 sec to 150 sec
260 + 0/−5°C
20 sec to 40 sec
6°C/sec max
8 minutes max
ADXL350

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