TQM8M9076-PCB 0.3-4.0GHZ EVAL BOARD TriQuint Semiconductor, TQM8M9076-PCB 0.3-4.0GHZ EVAL BOARD Datasheet - Page 9

• Manufacturer Part Number: TQM8M9076-PCB 0.3-4.0GHZ EVAL BOARD
• Description: RF Development Tools 50-4000MHz NF 3.7dB Gain 13dB Eval Brd
• Manufacturer: TriQuint Semiconductor

Specifications of TQM8M9076-PCB 0.3-4.0GHZ EVAL BOARD

• Rohs: yes
• Frequency: 300 MHz to 4 GHz
• Operating Supply Voltage: 5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Part # Aliases: 1079326

Datasheet: Rev. D 01-20-12
© 2012 TriQuint Semiconductor, Inc.
TQM8M9076
0.05-4 GHz Digital Variable Gain Amplifier
Package Information & Dimensions
Marking: Part number - TQM8M9076
PCB Mounting Pattern
Mechanical Information
NOTES:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation.
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
5. Place mounting screws near the part to fasten a back side heat sink.
6. Do not apply solder mask to the back side of the PC board in the heat sink contact region.
7. Ensure that the backside via region makes good physical contact with the heat sink.
Year, week, country code - YYWW CCCC
Assembly code – AaXXXX
We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10”).
32X
TERMINAL #1
IDENTIFIER
2X
.10 C
.08 C
5
2X
NOTES:
.10 C
.10 C
1. All dimensions are in millimeters. Angles are in degrees.
2. Except where noted, this part outline conforms to JEDEC standard MO-270, Issue B
3. Dimension and tolerance formats conform to ASME Y14.4M-1994.
4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
5. Co-planarity applies to the exposed ground/thermal pad as well as the contact pins.
6. Contact plating: Electrolytic plated Au over Ni
(Variation DAE) for extra thin profile, fine pitch, internal stacking module (ISM).
1
TQM8M9076
YYWW CCC
AaXXXX
5.0±0.1
25X
3
0.66
0.38
1.02±0.08
5.0±0.1
PACKAGE
OUTLINE
COMPONENT SIDE
0.76
C
SEATING PLANE
28X 0.75
- 9 of 11 -
28X 0.28
32X 0.10
4.50
1.90
1.90
0.20
32X 0.50 Pitch
3.70
(1X) shape
0.25
1.90
0.10
4.50
0.50 PITCH
C A B
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global
1.90
3.70
0.12
Network
0.25
TERMINAL #1
GND/THERMAL PAD
IDENTIFIER
(32X) 0.450x X 0.240y
®
0.10
5
C A B
4