PUMZ2 T/R NXP Semiconductors, PUMZ2 T/R Datasheet

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PUMZ2 T/R

Manufacturer Part Number
PUMZ2 T/R
Description
Transistors Bipolar - BJT TRANS DOUBLE TAPE-7
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PUMZ2 T/R

Product Category
Transistors Bipolar - BJT
Rohs
yes
Configuration
Dual
Transistor Polarity
NPN/PNP
Collector- Base Voltage Vcbo
60 V
Collector- Emitter Voltage Vceo Max
50 V
Emitter- Base Voltage Vebo
7 V
Collector-emitter Saturation Voltage
7 V
Gain Bandwidth Product Ft
100 MHz
Dc Collector/base Gain Hfe Min
120 at 1 mA at 6 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-363
Continuous Collector Current
0.15 A
Maximum Power Dissipation
300 mW
Minimum Operating Temperature
- 65 C
Factory Pack Quantity
3000
Part # Aliases
PUMZ2,115
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
NPN/PNP general-purpose double transistors.
Table 1.
Table 2.
Type number
PIMZ2
PUMZ2
Symbol
V
I
C
CEO
PIMZ2; PUMZ2
NPN/PNP general-purpose double transistors
Rev. 06 — 17 November 2009
Simplified circuit design
Reduced component count
Reduced pick and place costs
General-purpose switching and amplification
Product overview
Quick reference data
Parameter
collector-emitter voltage
collector current (DC)
Package
NXP
SOT457
SOT363
open base
Conditions
JEITA
SC-74
SC-88
Min
-
-
Configuration
NPN/PNP double transistors
NPN/PNP double transistors
Typ
-
-
Product data sheet
50
Max
150
Unit
V
mA

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PUMZ2 T/R Summary of contents

Page 1

... PIMZ2; PUMZ2 NPN/PNP general-purpose double transistors Rev. 06 — 17 November 2009 1. Product profile 1.1 General description NPN/PNP general-purpose double transistors. Table 1. Type number PIMZ2 PUMZ2 1.2 Features Simplified circuit design Reduced component count Reduced pick and place costs 1.3 Applications General-purpose switching and amplification 1.4 Quick reference data Table 2 ...

Page 2

... NXP Semiconductors 2. Pinning information Table 3. Pin PIMZ2 (SOT457 PUMZ2 (SOT363 Ordering information Table 4. Type number PIMZ2 PUMZ2 4. Marking Table 5. Type number PIMZ2 PUMZ2 [ made in Hong Kong * = t: made in Malaysia * = W: made in China PIMZ2_PUMZ2_6 Product data sheet NPN/PNP general-purpose double transistors ...

Page 3

... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor; for the PNP transistor with negative polarity V CBO V CEO V EBO tot T stg amb Per device P tot [1] Device mounted on an FR4 printed-circuit board. ...

Page 4

... NXP Semiconductors 7. Characteristics Table 8. Characteristics ° unless otherwise specified. amb Symbol Parameter Per transistor; for the PNP transistor with negative polarity; unless otherwise specified I collector-base cut-off current V CBO I emitter-base cut-off current EBO h DC current gain FE TR1 (PNP) V collector-emitter saturation CEsat ...

Page 5

... NXP Semiconductors 8. Package outline Plastic surface-mounted package (TSOP6); 6 leads pin 1 index 1 e DIMENSIONS (mm are the original dimensions) UNIT 0.1 0.40 1.1 0.26 mm 0.013 0.25 0.10 0.9 OUTLINE VERSION IEC SOT457 Fig 1. Package outline SOT457 (SC-74) PIMZ2_PUMZ2_6 Product data sheet NPN/PNP general-purpose double transistors ...

Page 6

... NXP Semiconductors Plastic surface-mounted package; 6 leads pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.8 0.20 0.10 OUTLINE VERSION IEC SOT363 Fig 2. Package outline SOT363 (SC-88) PIMZ2_PUMZ2_6 Product data sheet NPN/PNP general-purpose double transistors ...

Page 7

... Revision history Document ID Release date PIMZ2_PUMZ2_6 20091117 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Table 3 • Figure 1 “Package outline SOT457 • ...

Page 8

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 9

... NXP Semiconductors 12. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Legal information 10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 10.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 ...

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