BSP19 T/R NXP Semiconductors, BSP19 T/R Datasheet

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BSP19 T/R

Manufacturer Part Number
BSP19 T/R
Description
Transistors Bipolar - BJT TRANS HV TAPE-7
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BSP19 T/R

Product Category
Transistors Bipolar - BJT
Rohs
yes
Configuration
Single
Transistor Polarity
NPN
Collector- Base Voltage Vcbo
400 V
Collector- Emitter Voltage Vceo Max
350 V
Emitter- Base Voltage Vebo
5 V
Collector-emitter Saturation Voltage
5 V
Dc Collector/base Gain Hfe Min
40 at 20 mA at 10 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-223
Continuous Collector Current
0.1 A
Maximum Power Dissipation
1200 mW
Minimum Operating Temperature
- 65 C
Factory Pack Quantity
1000
Part # Aliases
BSP19,115
Product data sheet
Supersedes data of 1997 Mar 03
ndbook, halfpage
DATA SHEET
BSP19; BSP20
NPN high-voltage transistors
DISCRETE SEMICONDUCTORS
M3D087
1999 Jun 01

Related parts for BSP19 T/R

BSP19 T/R Summary of contents

Page 1

... DATA SHEET ndbook, halfpage BSP19; BSP20 NPN high-voltage transistors Product data sheet Supersedes data of 1997 Mar 03 DISCRETE SEMICONDUCTORS M3D087 1999 Jun 01 ...

Page 2

... NXP Semiconductors NPN high-voltage transistors FEATURES • Low current (max. 100 mA) • High voltage (max. 350 V). APPLICATIONS • Switching and amplification • Especially used in telephony and automotive applications. DESCRIPTION NPN transistor in a SOT223 plastic package. PNP complement: BSP16. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). ...

Page 3

... NXP Semiconductors NPN high-voltage transistors THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to ambient th j-a R thermal resistance from junction to soldering point th j-s Note 1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook” ...

Page 4

... NXP Semiconductors NPN high-voltage transistors PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads DIMENSIONS (mm are the original dimensions) UNIT 1.8 0.10 0.80 3.1 mm 1.5 0.01 0.60 2.9 OUTLINE VERSION IEC SOT223 1999 Jun ...

Page 5

... NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. ...

Page 6

... NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www ...

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