W25Q32BVSSIG Winbond Electronics, W25Q32BVSSIG Datasheet - Page 66
W25Q32BVSSIG
Manufacturer Part Number
W25Q32BVSSIG
Description
IC SPI FLASH 32MBIT 8SOIC
Manufacturer
Winbond Electronics
Datasheet
1.W25Q32BVZPIG.pdf
(79 pages)
Specifications of W25Q32BVSSIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
32M (4M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
W25Q32BVSSIG
Manufacturer:
Winbond
Quantity:
1 000
Company:
Part Number:
W25Q32BVSSIG
Manufacturer:
WINBOND
Quantity:
9 310
Company:
Part Number:
W25Q32BVSSIG
Manufacturer:
Winbond
Quantity:
6 600
Part Number:
W25Q32BVSSIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
8.5 AC Measurement Conditions
Note:
1. Output Hi-Z is defined as the point where data out is no longer driven.
PARAMETER
Load Capacitance
Input Rise and Fall Times
Input Pulse Voltages
Input Timing Reference Voltages
Output Timing Reference Voltages
Input Levels
0.8 VCC
0.2 VCC
Figure 39. AC Measurement I/O Waveform
SYMBOL
T
- 66 -
O
R
V
C
IN
, T
UT
IN
L
F
Timi
I
ng Reference Levels
nput and Output
MIN
0.2 VCC to 0.8 VCC
0.3 VCC to 0.7 VCC
0.5 VCC to 0.5 VCC
0.5 VCC
SPEC
MAX
30
5
W25Q32BV
UNIT
pF
ns
V
V
V