NAND128W3A2BN6F NUMONYX, NAND128W3A2BN6F Datasheet - Page 6

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NAND128W3A2BN6F

Manufacturer Part Number
NAND128W3A2BN6F
Description
IC FLASH 128MBIT 48TSOP
Manufacturer
NUMONYX
Datasheets

Specifications of NAND128W3A2BN6F

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
128M (16M x 8)
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP
Package
48TSOP
Cell Type
NAND
Density
128 Mb
Architecture
Sectored
Block Organization
Symmetrical
Typical Operating Supply Voltage
3|3.3 V
Sector Size
16KByte x 1024
Timing Type
Asynchronous
Interface Type
Parallel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NAND128W3A2BN6F
Manufacturer:
MICROCHIP
Quantity:
1 000
Part Number:
NAND128W3A2BN6F
Manufacturer:
ST
Quantity:
20 000
NAND128-A, NAND256-A, NAND512-A, NAND01G-A
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
APPENDIX A.HARDWARE INTERFACE EXAMPLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6/56
Table 25. TFBGA55 8 x 10mm - 6x8 active ball array - 0.80mm pitch, Package Mechanical Data 49
Figure 43.VFBGA63 8.5 x 15mm - 6x8 active ball array, 0.80mm pitch, Package Outline . . . . . . . 50
Table 26. VFBGA63 8.5 x 15mm - 6x8 active ball array, 0.80mm pitch, Package Mechanical Data50
Figure 44.TFBGA63 8.5 x 15mm - 6x8 active ball array, 0.80mm pitch, Package Outline . . . . . . . 51
Table 27. TFBGA63 8.5 x 15mm - 6x8 active ball array, 0.80mm pitch, Package Mechanical Data51
Table 28. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 45.Connection to Microcontroller, Without Glue Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Figure 46.Connection to Microcontroller, With Glue Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figure 47.Building Storage Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 29. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

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