CY62157EV30LL-45ZXI Cypress Semiconductor Corp, CY62157EV30LL-45ZXI Datasheet

IC SRAM 8MBIT 45NS 48TSOP

CY62157EV30LL-45ZXI

Manufacturer Part Number
CY62157EV30LL-45ZXI
Description
IC SRAM 8MBIT 45NS 48TSOP
Manufacturer
Cypress Semiconductor Corp
Type
Asynchronousr

Specifications of CY62157EV30LL-45ZXI

Memory Size
8M (512K x 16)
Package / Case
48-TSOP I
Format - Memory
RAM
Memory Type
SRAM
Speed
45ns
Interface
Parallel
Voltage - Supply
2.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Access Time
45 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.2 V
Maximum Operating Current
25 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Ports
1
Operating Supply Voltage
2.5 V, 3.3 V
Density
8Mb
Access Time (max)
45ns
Sync/async
Asynchronous
Architecture
Not Required
Clock Freq (max)
Not RequiredMHz
Operating Supply Voltage (typ)
2.5/3.3V
Address Bus
19b
Package Type
TSOP-I
Operating Temp Range
-40C to 85C
Supply Current
25mA
Operating Supply Voltage (min)
2.2V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
48
Word Size
16b
Number Of Words
512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-2080-5
CY62157EV30LL-45ZXI

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY62157EV30LL-45ZXI
Manufacturer:
CYPRESS
Quantity:
3 000
Part Number:
CY62157EV30LL-45ZXI
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
8-Mbit (512 K × 16) Static RAM
Features
Cypress Semiconductor Corporation
Document #: 38-05445 Rev. *I
Logic Block Diagram
Thin small outline package (TSOP) I package configurable as
512 K × 16 or 1 M × 8 static RAM (SRAM)
High speed: 45 ns
Temperature ranges
Wide voltage range: 2.20 V to 3.60 V
Pin compatible with CY62157DV30
Ultra low standby power
Ultra low active power
Easy memory expansion with CE
Automatic power down when deselected
Complementary Metal Oxide Semiconductor (CMOS) for
optimum speed and power
Available in Pb-free and non Pb-free 48-ball very fine-pitch ball
grid array (VFBGA), Pb-free 44-pin TSOP II and 48-pin TSOP I
packages
Industrial: –40 °C to +85 °C
Automotive-A: –40 °C to +85 °C
Automotive-E: –40 °C to +125 °C
Typical standby current: 2 A
Maximum standby current: 8 A (Industrial)
Typical active current: 1.8 mA at f = 1 MHz
Power Down
Circuit
A
A
A
A
A
A
A
A
A
A
A
10
9
8
7
6
5
4
3
2
1
0
1
, CE
CE
CE
2
, and OE features
BHE
BLE
2
1
198 Champion Court
COLUMN DECODER
512 K × 16/1 M x 8
DATA IN DRIVERS
RAM Array
8-Mbit (512 K × 16) Static RAM
Functional Description
The CY62157EV30 is a high performance CMOS static RAM
organized as 512K words by 16 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life (MoBL
applications such as cellular telephones. The device also has an
automatic power down feature that significantly reduces power
consumption when addresses are not toggling. Place the device
into standby mode when deselected (CE
both BHE and BLE are HIGH). The input or output pins (I/O
through I/O
device is deselected (CE
disabled (OE HIGH), Byte High Enable and Byte Low Enable are
disabled (BHE, BLE HIGH), or a write operation is active (CE
LOW, CE
To write to the device, take Chip Enable (CE
HIGH) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O
written into the location specified on the address pins (A
A
(I/O
address pins (A
To read from the device, take Chip Enable (CE
HIGH) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins appear
on I/O
memory appears on I/O
for a complete description of read and write modes.
18
). If Byte High Enable (BHE) is LOW, then data from I/O pins
8
through I/O
0
to I/O
2
HIGH and WE LOW).
15
San Jose
7
) are placed in a high impedance state when the
. If Byte High Enable (BHE) is LOW, then data from
0
15
through A
) is written into the location specified on the
,
CA 95134-1709
8
1
to I/O
CY62157EV30 MoBL
HIGH or CE
18
).
I/O
I/O
15
OE
BLE
BYTE
BHE
WE
. See
0
8
–I/O
–I/O
2
Truth Table on page 13
7
15
1
LOW), the outputs are
Revised May 30, 2011
HIGH or CE
0
1
CE
CE
through I/O
1
LOW and CE
LOW and CE
408-943-2600
®
1
2
) in portable
2
0
LOW or
through
7
) is
®
0
1
2
2
[+] Feedback

Related parts for CY62157EV30LL-45ZXI

CY62157EV30LL-45ZXI Summary of contents

Page 1

... Power Down Circuit Cypress Semiconductor Corporation Document #: 38-05445 Rev. *I 8-Mbit (512 K × 16) Static RAM Functional Description The CY62157EV30 is a high performance CMOS static RAM organized as 512K words by 16 bits. This device features advanced circuit design to provide ultra low active current. This is ideal for providing More Battery Life ...

Page 2

Contents Pin Configuration .............................................................3 Product Portfolio ..............................................................3 Maximum Ratings .............................................................4 Operating Range ...............................................................4 Electrical Characteristics .................................................4 Capacitance ......................................................................5 Thermal Resistance ..........................................................5 Data Retention Characteristics .......................................6 Data Retention Waveform ................................................6 Switching Characteristics ................................................7 Switching Waveforms ......................................................8 Read Cycle No. 1 (Address ...

Page 3

... A1 24 Product Portfolio Product Range CY62157EV30LL Industrial/Auto-A Auto-E Notes 1. NC pins are not connected on the die. 2. The 44-pin TSOP II package has only one chip enable (CE) pin. 3. The BYTE pin in the 48-pin TSOP I package must be tied HIGH to use the device as a 512 K × 16 SRAM. The 48-pin TSOP I package can also be used × 8 SRAM by tying the BYTE signal LOW ...

Page 4

... Document #: 38-05445 Rev. *I Output Current into Outputs (LOW) ............................20 mA Static Discharge Voltage ........................................> 2001 V (MIL-STD-883, Method 3015) Latch Up Current ...................................................> 200 mA Operating Range Device + 0.3 V) CY62157EV30LL Industrial/ CCmax + 0.3 V) CCmax + 0 max 45 ns (Industrial/ Auto-A) Test Conditions Min Typ = –0.1 mA 2.0 = – ...

Page 5

Capacitance [10] Parameter Description C Input capacitance IN C Output capacitance OUT Thermal Resistance [10] Parameter Description  Thermal resistance JA (Junction to Ambient)  Thermal resistance JC (Junction to Case OUTPUT 30 pF INCLUDING JIG AND ...

Page 6

... BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling chip enable signals or by disabling both BHE and BLE. Document #: 38-05445 Rev. *I Conditions = 1 > V – 0.2 V, Industrial/Auto < 0 Auto-E – 0 > V – 0 < 0 CY62157EV30LL-45 CY62157EV30LL-55 [15] Figure 5. Data Retention Waveform DATA RETENTION MODE > 1.5V V CC(min CDR > 100 s or stable at V > 100  CC(min) CC(min) ® CY62157EV30 MoBL [11] Min Typ Max Unit 1 ...

Page 7

... If both byte enables are toggled together, this value is 10 ns. 21. The internal write time of the memory is defined by the overlap of WE and any of these signals can terminate a write by going inactive. The data input setup and hold timing must be referenced to the edge of the signal that terminates the write ...

Page 8

Switching Waveforms Read Cycle No. 1 (Address Transition Controlled) ADDRESS DATA OUT PREVIOUS DATA VALID Read Cycle No. 2 (OE Controlled) ADDRESS BHE/BLE t LZBE OE HIGH IMPEDANCE DATA OUT t LZCE ...

Page 9

... HZOE Notes 25. The internal write time of the memory is defined by the overlap of WE write and any of these signals can terminate a write by going inactive. The data input setup and hold timing must be referenced to the edge of the signal that terminates the write. 26. Data I/O is high impedance ...

Page 10

... HZOE Notes 29. The internal write time of the memory is defined by the overlap of WE write and any of these signals can terminate a write by going inactive. The data input setup and hold timing must be referenced to the edge of the signal that terminates the write. 30. Data I/O is high impedance ...

Page 11

Switching Waveforms (continued) Write Cycle No. 3 (WE Controlled, OE LOW) ADDRESS BHE/BLE NOTE 34 DATA I/O t HZWE Notes 33 goes HIGH and CE goes LOW simultaneously with WE = ...

Page 12

Switching Waveforms (continued) Write Cycle No. 4 (BHE/BLE Controlled, OE LOW) ADDRESS BHE/BLE NOTE 36 DATA I/O Notes 35 goes HIGH and CE goes LOW simultaneously with ...

Page 13

Truth Table BHE 1 2 [37 [37 [37] [37 ...

Page 14

... Ordering Information Speed (ns) Ordering Code 45 CY62157EV30LL-45BVI CY62157EV30LL-45BVXI CY62157EV30LL-45ZSXI CY62157EV30LL-45ZXI CY62157EV30LL-45BVXA CY62157EV30LL-45ZSXA CY62157EV30LL-45ZXA 55 CY62157EV30LL-55ZSXE CY62157EV30LL-55ZXE Contact your local Cypress sales representative for availability of these parts. Ordering Code Definitions 621 5 E V30 Document #: 38-05445 Rev. *I Package Package Type Diagram 51-85150 48-ball very fine-pitch ball grid array ...

Page 15

Package Diagrams Figure 6. 48-pin VFBGA (6 × 8 × 1 mm) BV48/BZ48, 51-85150 Document #: 38-05445 Rev. *I ® CY62157EV30 MoBL 51-85150 *F Page [+] Feedback ...

Page 16

Package Diagrams (continued) Document #: 38-05445 Rev. *I Figure 7. 44-pin TSOP Z44-II, 51-85087 ® CY62157EV30 MoBL 51-85087 *C Page [+] Feedback ...

Page 17

Package Diagrams (continued) Figure 8. 48-pin TSOP I (12 × 18.4 × 1.0 mm) Z48A, 51-85183 Document #: 38-05445 Rev. *I ® CY62157EV30 MoBL 51-85183 *B Page [+] Feedback ...

Page 18

... CMOS complementary metal oxide semiconductor I/O input/output OE output enable RAM random access memory SRAM static random access memory TSOP thin small outline package VFBGA very fine-pitch ball grid array WE write enable Document #: 38-05445 Rev. *I CY62157EV30 MoBL Document Conventions Units of Measure ...

Page 19

Document History Page Document Title: CY62157EV30 MoBL Document Number: 38-05445 Orig. of Submission Rev. ECN No. Change Date ** 202940 AJU See ECN *A 291272 SYT See ECN *B 444306 NXR See ECN *C 467052 NXR See ECN *D 925501 ...

Page 20

Document History Page (continued) Document Title: CY62157EV30 MoBL Document Number: 38-05445 Orig. of Submission Rev. ECN No. Change Date *F 2724889 NXR/AESA 06/26/09 *G 2927528 VKN 05/04/2010 Renamed “DNU” pins as “NC” for 48 TSOP I package *H 3110053 PRAS ...

Page 21

... Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement ...

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