AT45DB161D-SU Atmel, AT45DB161D-SU Datasheet - Page 11
![IC FLASH 16MBIT 66MHZ 8SOIC](/photos/6/50/65032/453-8-soic_sml.jpg)
AT45DB161D-SU
Manufacturer Part Number
AT45DB161D-SU
Description
IC FLASH 16MBIT 66MHZ 8SOIC
Manufacturer
Atmel
Datasheets
1.AT45DB161D-CU.pdf
(51 pages)
2.AT45DB161D-SU.pdf
(6 pages)
3.AT45DB161D-SU.pdf
(53 pages)
Specifications of AT45DB161D-SU
Format - Memory
FLASH
Memory Type
DataFLASH
Memory Size
16M (4096 pages x 528 bytes)
Speed
66MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Architecture
Sectored
Interface Type
SPI
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Maximum Operating Current
15 mA
Mounting Style
SMD/SMT
Organization
128 KB x 16
Current, Input, Leakage
1 μA
Current, Operating
11 mA (Read), 12 mA (Program/Erase)
Current, Output, Leakage
1
Data Retention
20 yrs.
Density
16M
Package Type
EIAJ SOIC
Temperature, Operating
-40 to +85 °C
Time, Access
6 ns
Time, Address Hold
5
Time, Address Setup
5
Time, Fall
6.8 ns
Time, Rise
6.8 ns
Voltage, Input, High
1.89 to 2.52 V
Voltage, Input, Low
0.81 to 1.08 V
Voltage, Output, High
2.5 V
Voltage, Output, Low
0.4 V
Voltage, Supply
2.7 to 3.6 V
Memory Configuration
4096 Pages X 528 Bytes
Clock Frequency
66MHz
Supply Voltage Range
2.5V To 3.6V, 2.7V To 3.6V
Rohs Compliant
Yes
Access Time (max)
6ns
Boot Type
Not Required
Address Bus
1b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Supply Current
15mA
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT45DB161D-SU
Manufacturer:
ATMEL
Quantity:
106 020
Company:
Part Number:
AT45DB161D-SU
Manufacturer:
AYMEL
Quantity:
1
Part Number:
AT45DB161D-SU
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
Part Number:
AT45DB161D-SU-2.5
Manufacturer:
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Quantity:
20 000
Company:
Part Number:
AT45DB161D-SU-N03
Manufacturer:
NS
Quantity:
487
Company:
Part Number:
AT45DB161D-SU-SL383
Manufacturer:
AMS
Quantity:
30 000
7.8
8. Sector Protection
3500I–DFLASH–8/07
Main Memory Page Program Through Buffer
The WP pin can be asserted while the device is erasing, but protection will not be activated until
the internal erase cycle completes.
Figure 7-1.
Note:
This operation is a combination of the Buffer Write and Buffer to Main Memory Page Program
with Built-in Erase operations. Data is first clocked into buffer 1 or buffer 2 from the input pin (SI)
and then programmed into a specified page in the main memory. To perform a main memory
page program through buffer for the standard DataFlash page size (528 bytes), a 1-byte opcode,
82H for buffer 1 or 85H for buffer 2, must first be clocked into the device, followed by three
address bytes. The address bytes are comprised of 2 don’t care bits, 12 page address bits,
(PA11 - PA0) that select the page in the main memory where data is to be written, and 10 buffer
address bits (BFA9 - BFA0) that select the first byte in the buffer to be written. To perform a
main memory page program through buffer for the binary page size (512 bytes), the opcode 82H
for buffer 1 or 85H for buffer 2, must be clocked into the device followed by three address bytes
consisting of 3 don’t care bits, 12 page address bits (A20 - A9) that specify the page in the main
memory to be written, and 9 buffer address bits (BFA8 - BFA0) that selects the first byte in the
buffer to be written. After all address bytes are clocked in, the part will take data from the input
pins and store it in the specified data buffer. If the end of the buffer is reached, the device will
wrap around back to the beginning of the buffer. When there is a low-to-high transition on the CS
pin, the part will first erase the selected page in main memory to all 1s and then program the
data stored in the buffer into that memory page. Both the erase and the programming of the
page are internally self-timed and should take place in a maximum time of t
the status register and the RDY/BUSY pin will indicate that the part is busy.
Two protection methods, hardware and software controlled, are provided for protection against
inadvertent or erroneous program and erase cycles. The software controlled method relies on
the use of software commands to enable and disable sector protection while the hardware con-
trolled method employs the use of the Write Protect (WP) pin. The selection of which sectors
that are to be protected or unprotected against program and erase operations is specified in the
nonvolatile Sector Protection Register. The status of whether or not sector protection has been
enabled or disabled by either the software or the hardware controlled methods can be deter-
mined by checking the Status Register.
Command
Chip Erase
1. Refer to the errata regarding Chip Erase on
Chip Erase
CS
SI
Each transition
represents 8 bits
Opcode
Byte 1
Opcode
Byte 1
Byte 2
C7H
page
Opcode
Byte 3
52.
Byte 2
94H
Opcode
Byte 4
AT45DB161D
Byte 3
80H
EP
. During this time,
Byte 4
9AH
11