AT45DB041D-MU-2.5 Atmel, AT45DB041D-MU-2.5 Datasheet - Page 52

• Manufacturer Part Number: AT45DB041D-MU-2.5
• Description: IC FLASH 4MBIT 66MHZ 8MLF
• Manufacturer: Atmel

Specifications of AT45DB041D-MU-2.5

• Format - Memory: FLASH
• Memory Type: DataFLASH
• Memory Size: 4M (2048 pages x 264 bytes)
• Speed: 66MHz
• Interface: SPI, RapidS
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-VFQFN, 8-VFQFPN
• Architecture: Sectored
• Interface Type: SPI
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 15 mA
• Mounting Style: SMD/SMT
• Organization: 64 KB x 8
• Density: 4Mb
• Access Time (max): 8ns
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: MLF
• Program/erase Volt (typ): 2.5 to 3.6V
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 3.6V
• Supply Current: 15mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

27.3
52
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
8S2 – EIAJ SOIC
2. Mismatch of the upper and lower dies and resin burrs aren't included.
3. Determines the true geometric position.
4. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm.
AT45DB041D
Package Drawing Contact:
[e-mail]
e e
TOP VIEW
TOP VIEW
SIDE VIEW
SIDE VIEW
TITLE
8S2, 8-lead, 0.208” Body, Plastic Small
Outline Package (EIAJ)
D D
1 1
N N
A A
b b
A1
A1
E E
SYMBOL
A
A1
b
C
D
E1
E
L
θ
e
END VIEW
END VIEW
θ θ
COMMON DIMENSIONS
1.70
0.05
0.35
0.15
5.13
5.18
7.70
0.51
MIN
(Unit of Measure = mm)
0°
GPC
STN
1.27 BSC
L L
NOM
E1
E1
DRAWING NO.
MAX
2.16
0.25
0.48
0.35
5.35
5.40
8.26
0.85
8°
8S2
3595P–DFLASH–09/09
NOTE
4
4
2
3
4/15/08
REV.
F