MT46V64M8P-75:D Micron Technology Inc, MT46V64M8P-75:D Datasheet - Page 21

• Manufacturer Part Number: MT46V64M8P-75:D
• Description: IC DDR SDRAM 512MBIT 66TSOP
• Manufacturer: Micron Technology Inc

Specifications of MT46V64M8P-75:D

• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Memory Size: 512M (64M x 8)
• Speed: 7.5ns
• Interface: Parallel
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 66-TSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 14:
Table 15:
Table 16:
Table 17:
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 512Mb DDR: Rev. L; Core DDR Rev. A 4/07 EN
Parameter
Parameter
Parameter
Parameter
Delta input/output capacitance: DQ0–DQ3 (x4), DQ0–DQ7 (x8)
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQs, DQS, DM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Delta input/output capacitance: DQs, DQS, DM
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQs, DQS, DM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Delta input/output capacitance: DQ0–DQ7, LDQS, LDM
Delta input/output capacitance: DQ8–DQ15, UDQS, UDM
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQ, LDQS, UDQS, LDM, UDM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Delta input/output capacitance: DQ0–DQ7, LDQS, LDM
Delta input/output capacitance: DQ8–DQ15, UDQS, UDM
Delta input capacitance: Command and address
Delta input capacitance: CK, CK#
Input/output capacitance: DQ, LDQS, UDQS, LDM, UDM
Input capacitance: Command and address
Input capacitance: CK, CK#
Input capacitance: CKE
Capacitance (x4, x8 TSOP – 128Mb, 256Mb, 512Mb, 1Gb)
Note: 14 applies to entire table; Notes appear on pages 28–34
Capacitance (x4, x8 FBGA – 256Mb and 512Mb only)
Note: 14 applies to entire table; Notes appear on pages 28–34
Capacitance (x16 TSOP – 128Mb, 256Mb, 512Mb, 1Gb)
Note: 14 applies to entire table; Notes appear on pages 28–34
Capacitance (x16 FBGA – 256Mb and 512Mb only)
Note: 14 applies to entire table; Notes appear on pages 28–34
21
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Symbol
Symbol
Symbol
Symbol
Electrical Specifications – DC and AC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
DC
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
IO
IO
IO
IO
I
I
I
I
I
I
I
I
I
I
I
I
IOU
IOU
IOL
IOL
1
2
3
1
2
3
1
2
3
1
2
3
IO
IO
I
I
I
I
I
I
I
I
1
2
1
2
1
2
1
2
512Mb: x4, x8, x16 DDR SDRAM
Min
Min
Min
Min
4.0
2.0
2.0
2.0
3.5
1.5
1.5
1.5
4.0
2.0
2.0
2.0
3.5
1.5
1.5
1.5
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Max
Max
Max
Max
0.50
0.50
0.25
0.50
0.50
0.25
0.50
0.50
0.50
0.25
0.50
0.50
0.50
0.25
©2000 Micron Technology, Inc. All rights reserved.
5.0
3.0
3.0
3.0
4.5
2.5
2.5
2.5
5.0
3.0
3.0
3.0
4.5
2.5
2.5
2.5
Units
Units
Units
Units
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Notes
Notes
Notes
Notes
25
30
30
25
30
30
25
25
30
30
25
25
30
30