MT46H8M32LFB5-6:A TR Micron Technology Inc, MT46H8M32LFB5-6:A TR Datasheet - Page 12
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MT46H8M32LFB5-6:A TR
Manufacturer Part Number
MT46H8M32LFB5-6:A TR
Description
IC DDR SDRAM 256MBIT 90VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Specifications of MT46H8M32LFB5-6:A TR
Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
256M (8Mx32)
Speed
166MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
0°C ~ 70°C
Package / Case
90-VFBGA
Organization
8Mx32
Density
256Mb
Address Bus
14b
Access Time (max)
6.5/5ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
120mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1280-2
MT46H8M32LFB5-6:A TR
MT46H8M32LFB5-6:A TR
Table 4:
PDF: 09005aef82091978 / Source: 09005aef8209195b
MT46H16M16LF__2.fm - Rev. H 6/08 EN
R8, P7, P8, N7, N8, M7,
N2, N3, P2, P3, R2, A8,
B7, B8, C7, C8, D7, D8,
E7, E3, D2, D3, C2, C3,
A7, B1, C9, D1, E9, L9,
J8, J9, K7, K9, K1, K3,
J1, J2, J3, H1, J7, H2
M8, L7, L3, M2, M3,
Ball Numbers
M1, N9, P1, R7
K8, K2, F8, F2
L8, L2, E8, E2
G9, G8, G7
B2, B3, A2
G2, G3
H8, H9
G1
H7
H3
90-Ball VFBGA Ball Description
RAS#, CAS#,
DQS0–DQS3
DQ0–DQ31
DM0–DM3
BA0, BA1
A12/DNU
Symbol
CK, CK#
A0–A11
V
WE#
CKE
CS#
DD
Q
Supply
Input
Input
Input
Input
Input
Input
Input
Input
Type
I/O
I/O
Clock: CK is the system clock input. CK and CK# are differential clock
inputs. All address and control input signals are sampled on the
crossing of the positive edge of CK and the negative edge of CK#. Input
and output data is referenced to the crossing of CK and CK# (both
directions of the crossing).
Clock enable: CKE HIGH activates and CKE LOW deactivates the
internal clock signals, input buffers, and output drivers. Taking CKE
LOW enables PRECHARGE power-down and SELF REFRESH operations
(all banks idle) or ACTIVE power-down (row active in any bank). CKE is
synchronous for all functions except SELF REFRESH exit. All input
buffers (except CKE) are disabled during power-down and self refresh
modes.
Chip select: CS# enables the command decoder (registered LOW) and
disables the command decoder (registered HIGH). All commands are
masked when CS# is registered HIGH. CS# provides for external bank
selection on systems with multiple banks. CS# is considered part of the
command code.
Command inputs: RAS#, CAS#, and WE# (along with CS#) define the
command being entered.
Input data mask: DM is an input mask signal for write data. Input
data is masked when DM is sampled HIGH along with that input data
during a WRITE access. DM is sampled on both edges of DQS. Although
DM balls are input-only, the DM loading is designed to match that of
DQ and DQS balls. For the x32, DM0 is DM for DQ0–DQ7; DM1 is DM
for DQ8–DQ15; DM2 is DM for DQ16–DQ23; and DM3 is DM for DQ24–
DQ31.
Bank address inputs: BA0 and BA1 define to which bank an ACTIVE,
READ, WRITE, or PRECHARGE command is being applied. BA0 and BA1
also determine which mode register (standard mode register or
extended mode register) is loaded during a LOAD MODE REGISTER
command.
Address inputs: Provide the row address for ACTIVE commands, and
the column address and auto precharge bit (A10) for READ or WRITE
commands, to select one location out of the memory array in the
respective bank. During a PRECHARGE command, A10 determines
whether the PRECHARGE applies to one bank (A10 LOW, bank selected
by BA0, BA1) or all banks (A10 HIGH). The address inputs also provide
the op-code during a LOAD MODE REGISTER command.
A12 is an address input for the LG reduced page-size option (see
“Options” on page 1). Leave as DNU for JEDEC-standard option.
Data input/output: Data bus for x32.
Data strobe: Output with read data, input with write data. DQS is
edge-aligned with read data, center-aligned with write data. Data
strobe is used to capture data.
DQ power supply.
12
Micron Technology, Inc., reserves the right to change products or specifications without notice.
256Mb: x16, x32 Mobile DDR SDRAM
Description
General Description
©2005 Micron Technology, Inc. All rights reserved.