CY7C1480V33-167BZI Cypress Semiconductor Corp, CY7C1480V33-167BZI Datasheet - Page 7

IC SRAM 72MBIT 167MHZ 165LFBGA

CY7C1480V33-167BZI

Manufacturer Part Number
CY7C1480V33-167BZI
Description
IC SRAM 72MBIT 167MHZ 165LFBGA
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1480V33-167BZI

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (2M x 36)
Speed
167MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
165-LFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1480V33-167BZI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Document #: 38-05283 Rev. *G
Pin Definitions
A
BW
BW
GW
BWE
CLK
CE
CE
CE
OE
ADV
ADSP
ADSC
ZZ
DQs, DQPs
V
V
V
V
Pin Name
0
DD
SS
SSQ
DDQ
, A
1
2
3
A
E
,BW
,BW
1
, A
B
F
,BW
,BW
G
C
,BW
,BW
H
D
,
Asynchronous
Asynchronous
Power Supply Power supply inputs to the core of the device.
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
Synchronous
I/O Ground
I/O Power
Ground
Supply
Input-
Input-
Input-
Input-
Input-
Clock
Input-
Input-
Input-
Input-
Input-
Input-
Input-
Input-
I/O-
I/O
Address Inputs used to select one of the address locations. Sampled at the rising
edge of the CLK if ADSP or ADSC is active LOW, and CE
active. A1: A0 are fed to the two-bit counter.
Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes to
the SRAM. Sampled on the rising edge of CLK.
Global Write Enable Input, active LOW. When asserted LOW on the rising edge of
CLK, a global write is conducted (ALL bytes are written, regardless of the values on
BW
Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal
must be asserted LOW to conduct a byte write.
Clock Input. Used to capture all synchronous inputs to the device. Also used to
increment the burst counter when ADV is asserted LOW, during a burst operation.
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in
conjunction with CE
HIGH. CE
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in
conjunction with CE
a new external address is loaded.
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in
conjunction with CE
a new external address is loaded.
Output Enable, asynchronous input, active LOW. Controls the direction of the I/O
pins. When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are
tri-stated, and act as input data pins. OE is masked during the first clock of a read cycle
when emerging from a deselected state.
Advance Input signal, sampled on the rising edge of CLK, active LOW. When
asserted, it automatically increments the address in a burst cycle.
Address Strobe from Processor, sampled on the rising edge of CLK, active LOW.
When asserted LOW, addresses presented to the device are captured in the address
registers. A1: A0 are also loaded into the burst counter. When ADSP and ADSC are
both asserted, only ADSP is recognized. ASDP is ignored when CE
HIGH.
Address Strobe from Controller, sampled on the rising edge of CLK, active LOW.
When asserted LOW, addresses presented to the device are captured in the address
registers. A1: A0 are also loaded into the burst counter. When ADSP and ADSC are
both asserted, only ADSP is recognized.
ZZ “sleep” Input, active HIGH. When asserted HIGH places the device in a
non-time-critical “sleep” condition with data integrity preserved. For normal operation,
this pin has to be LOW or left floating. ZZ pin has an internal pull-down.
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is
triggered by the rising edge of CLK. As outputs, they deliver the data contained in the
memory location specified by the addresses presented during the previous clock rise
of the read cycle. The direction of the pins is controlled by OE. When OE is asserted
LOW, the pins behave as outputs. When HIGH, DQs and DQP
condition.
Ground for the core of the device.
Ground for the I/O circuitry.
Power supply for the I/O circuitry.
X
and BWE).
1
is sampled only when a new external address is loaded.
1
1
2
and CE
and CE
and CE
2
3
3
to select/deselect the device. CE
to select/deselect the device. CE
to select/deselect the device. ADSP is ignored if CE
Description
1
, CE
X
CY7C1480V33
CY7C1482V33
CY7C1486V33
2
2
3
are placed in a tri-state
, and CE
is sampled only when
is sampled only when
1
is deasserted
3
Page 7 of 31
are sampled
1
is
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