HYB25D256160CF-5 Qimonda, HYB25D256160CF-5 Datasheet - Page 6

• Manufacturer Part Number: HYB25D256160CF-5
• Description: IC DDR SDRAM 256MBIT 60TFBGA
• Manufacturer: Qimonda

Specifications of HYB25D256160CF-5

• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Memory Size: 256M (16Mx16)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 60-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 675-1007-2

1) HYB and HYI: designator for memory components;
Rev. 2.4, 2007-07
03062006-8CCM-VPUW
Product Type
Standard Temperature Range (0 °C - +70 °C)
HYB25D256400CT–5
HYB25D256800CT–5
HYB25D256160CT–5
HYB25D256400CT–6
HYB25D256800CT–6
HYB25D256800CTL–6
HYB25D256160CT–6
HYB25D256400CT–7
HYB25D256400CC–5
HYB25D256800CC–5
HYB25D256160CC–5
HYB25D256400CC–6
HYB25D256800CC–6
HYB25D256160CC–6
Industrial Temperature Range (–40 °C - +85 °C)
HYI25D256800CT–5
HYI25D256160CT–5
HYI25D256800CT–6
HYI25D256160CT–6
HYI25D256800CC–5
HYI25D256160CC–5
HYI25D256800CC–6
HYI25D256160CC–6
25D: DDR SDRAMs at
256: 256-Mbit density;
400/800/160: product variations ×4, ×8 and ×16;
C: die revision C;
L: low power (available on request);
F/C/E/T: package type FBGA (lead & halogen free), FBGA (lead containing), TSOP (lead & halogen free), and TSOP (lead containing)
1)
V
Oganization CAS-RCD-RP
×4
×8
×16
×4
×8
×8
×16
×4
×4
×8
×16
×4
×8
×16
×8
×16
×8
×16
×8
×16
×8
×16
DDQ
= 2.5 V;
Latencies
3-3-3
2.5-3-3
3-3-3
2.5-3-3
3-3-3
2.5-3-3
3-3-3
2.5-3-3
Clock (MHz) Speed
200
166
143
200
166
200
166
200
166
6
Ordering Information for Lead-Containing Products
DDR400B P-TSOPII-66 —
DDR333
DDR266A
DDR400B P-TFBGA-60
DDR333
DDR400B P-TSOPII-66 —
DDR333
DDR400A P-TFBGA-60
DDR333
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
Package
256 Mbit Double-Data-Rate SDRAM
Note
Internet Data Sheet
TABLE 3