PCF8576DT/2,118 NXP Semiconductors, PCF8576DT/2,118 Datasheet - Page 42
![IC LCD DRIVER 40/160SEG 56TSSOP](/photos/6/90/69069/56-tssop_sml.jpg)
PCF8576DT/2,118
Manufacturer Part Number
PCF8576DT/2,118
Description
IC LCD DRIVER 40/160SEG 56TSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8576DT2118.pdf
(50 pages)
Specifications of PCF8576DT/2,118
Package / Case
56-TSSOP
Display Type
LCD
Configuration
40 Segment
Interface
I²C
Current - Supply
24µA
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Number Of Digits
20
Number Of Segments
160
Maximum Clock Frequency
400 KHz
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Power Dissipation
400 mW
Maximum Operating Temperature
+ 85 C
Maximum Supply Current
50 mA
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4703 - DEMO BOARD LCD GRAPHIC DRIVER
Digits Or Characters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-3558-2
935276166118
PCF8576DT/2-T
935276166118
PCF8576DT/2-T
NXP Semiconductors
18. Soldering of SMD packages
PCF8576D
Product data sheet
17.2 Carrier tape information
18.1 Introduction to soldering
18.2 Wave and reflow soldering
Table 24.
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Symbol
A0
B0
K0
P1
W
Fig 29. Tape details
W
pin 1 index
Carrier tape dimensions
B0
All information provided in this document is subject to legal disclaimers.
Description
pocket width in x direction
pocket width in y direction
pocket height
sprocket hole pitch
tape width in y direction
Rev. 10 — 14 February 2011
4
direction of feed
Universal LCD driver for low multiplex rates
P1
A0
PCF8576D
Value
8.6
14.5
1.8
12
24
© NXP B.V. 2011. All rights reserved.
001aaj314
K0
Unit
mm
mm
mm
mm
mm
42 of 50