PCF8562TT/2,118 NXP Semiconductors, PCF8562TT/2,118 Datasheet - Page 32

• Manufacturer Part Number: PCF8562TT/2,118
• Description: IC LCD DRIVER 32/128SEG 48-TSSOP
• Manufacturer: NXP Semiconductors

Specifications of PCF8562TT/2,118

• Package / Case: 48-TSSOP
• Display Type: LCD
• Configuration: 7 Segment + DP, 14 Segment (32 Segment)
• Interface: I²C
• Current - Supply: 32µA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Digits: 16
• Number Of Segments: 32
• Maximum Clock Frequency: 2640 Hz
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 85 C
• Attached Touch Screen: No
• Maximum Supply Current: 20 uA
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM6292 - DEMO BOARD PCA2125 RTCOM10088 - KIT FOR LCD DEMO LPC900622-1003 - KIT FOR LCD DEMO
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-2029-2; PCF8562TT/2,518; PCF8562TT/2-T

NXP Semiconductors
PCF8562_5
Product data sheet
14.3 Wave soldering
14.4 Reflow soldering
Key characteristics in wave soldering are:
Key characteristics in reflow soldering are:
Table 18.
Table 19.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
19
21.
Rev. 05 — 19 May 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Universal LCD driver for low multiplex rates
Figure
350 to 2000
260
250
245
21) than a SnPb process, thus
≥ 350
220
220
245
> 2000
260
245
PCF8562
© NXP B.V. 2010. All rights reserved.
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