PCF8562TT/2,118 NXP Semiconductors, PCF8562TT/2,118 Datasheet - Page 32
![IC LCD DRIVER 32/128SEG 48-TSSOP](/photos/6/50/65054/568-48-tssop_sot480-1_sml.jpg)
PCF8562TT/2,118
Manufacturer Part Number
PCF8562TT/2,118
Description
IC LCD DRIVER 32/128SEG 48-TSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8562TT2118.pdf
(37 pages)
Specifications of PCF8562TT/2,118
Package / Case
48-TSSOP
Display Type
LCD
Configuration
7 Segment + DP, 14 Segment (32 Segment)
Interface
I²C
Current - Supply
32µA
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Number Of Digits
16
Number Of Segments
32
Maximum Clock Frequency
2640 Hz
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Power Dissipation
400 mW
Maximum Operating Temperature
+ 85 C
Attached Touch Screen
No
Maximum Supply Current
20 uA
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
OM6292 - DEMO BOARD PCA2125 RTCOM10088 - KIT FOR LCD DEMO LPC900622-1003 - KIT FOR LCD DEMO
Digits Or Characters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-2029-2
PCF8562TT/2,518
PCF8562TT/2-T
PCF8562TT/2,518
PCF8562TT/2-T
NXP Semiconductors
PCF8562_5
Product data sheet
14.3 Wave soldering
14.4 Reflow soldering
Key characteristics in wave soldering are:
Key characteristics in reflow soldering are:
Table 18.
Table 19.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
19
21.
Rev. 05 — 19 May 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Universal LCD driver for low multiplex rates
Figure
350 to 2000
260
250
245
21) than a SnPb process, thus
≥ 350
220
220
245
> 2000
260
245
PCF8562
© NXP B.V. 2010. All rights reserved.
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