FAN7383MX_WS Fairchild Semiconductor, FAN7383MX_WS Datasheet - Page 5

• Manufacturer Part Number: FAN7383MX_WS
• Description: IC GATE DVR HALF BRIDGE 14-SOIC
• Manufacturer: Fairchild Semiconductor
• Type: High Side Driverr

Specifications of FAN7383MX_WS

• Configuration: Half Bridge
• Input Type: Non-Inverting
• Delay Time: 500ns
• Current - Peak: 350mA
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 600V
• Voltage - Supply: 15 V ~ 20 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Product: Half-Bridge Drivers
• Rise Time: 100 ns
• Fall Time: 80 ns
• Supply Voltage (max): 20 V
• Supply Voltage (min): 15 V
• Supply Current: 650 uA
• Maximum Power Dissipation: 1 W
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Bridge Type: Half Bridge
• Maximum Turn-off Delay Time: 170 ns
• Maximum Turn-on Delay Time: 670 ns
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Output Current: 350 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

FAN7383 Rev. 1.0.3
© 2006 Fairchild Semiconductor Corporation
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In
addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. T
Notes:
2. When mounted on 76.2 x 114.3 x 1.6mm PCB. (FR-4 glass epoxy material).
3. Please refer to:
4. Do not exceed P
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
JESD51-2: Integral circuits thermal test method environmental conditions - Natural convection
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages
P
Symbol
Symbol
dV
D
GND
T
V
V
V
V
V
V
V
V
(2)(3)(4)
V
V
θ
V
V
V
V
T
T
STG
HO
HO
DD
LO
DD
SD
S
JA
LO
DT
IN
IN
A
B
S
S
B
J
/dt
High-side offset voltage
High-side floating supply voltage
High-side floating output voltage HO1, HO2
Low-side and logic fixed supply voltage
Low-side output voltage LO1, LO2
Logic input voltage (IN)
Shutdown logic input voltage
Dead-time control voltage
Logic ground
Allowable offset voltage slew rate
Power dissipation
Thermal resistance, junction-to-ambient
Junction temperature
Storage temperature
High-side floating supply voltage
High-side floating supply offset voltage
Low-side supply voltage
High-side (HO) output voltage
Low-side (LO) output voltage
Logic input voltage (IN)
Ambient temperature
D
under any circumstances.
Parameter
Parameter
A
= 25°C unless otherwise specified.
5
Condition
V
V
V
Min.
DD
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
S
B
-0.3
-25
-25
V
6-V
Min.
GND
GND
S
-40
V
15
V
V
V
V
+15
V
V
S
DD
Max.
DD
DD
DD
DD
B
B
625
150
110
150
5.0
1.0
25
50
+0.3
+0.3
+0.3
+0.3
+0.3
+0.3
V
Max.
600
125
S
V
V
20
V
+20
DD
DD
B
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Unit
V/ns
°C/W
°C
°C
W
V
V
V
V
V
V
V
V
V
Unit
°C
V
V
V
V
V
V