IR3529MTRPBF International Rectifier, IR3529MTRPBF Datasheet

IC CTRL XPHASE CPU/ASIC 20-MLPQ

IR3529MTRPBF

Manufacturer Part Number
IR3529MTRPBF
Description
IC CTRL XPHASE CPU/ASIC 20-MLPQ
Manufacturer
International Rectifier
Series
XPhase3™r
Datasheet

Specifications of IR3529MTRPBF

Applications
Processor
Current - Supply
2mA
Voltage - Supply
8 V ~ 16 V
Operating Temperature
0°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
*
Package
20-Lead MLPQ
Circuit
X-Phase Phase IC
Iout (a)
4.0A Gate Driver
Pbf
PbF Option Available
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IR3529MTRPBFTR
DESCRIPTION
FEATURES
The IR3529 Phase IC combined with an IR XPhase3
implement power solutions for the latest high performance CPUs and ASICs. The “Control” IC provides overall
system control and interfaces with any number of “Phase” ICs which each drive and monitor a single phase of a
multiphase converter. The XPhase3
easier to design while providing higher efficiency than conventional approaches.
The IR3529 provides two types of current sense outputs; ILL which contains average power supply current,
information which can be used for voltage positioning and ISHARE which contains average active phase current
information since current sense amplifiers of respective phases are disabled when in power savings mode. Higher
efficiency can be expected due to increased driver capability along with reduced non-overlap durations. Turbo is
included to improve load turn-on response. A SHIFT pin now communicates to the control IC a change in phase
IC on-line status resulting in controlled phase timing during PSI and Phase Shedding.
implements cycle-by-cycle over current protection to resolve high repetition rate load transients.
Page 1 of 22
Reduced dead time
7V gate drivers (6A GATEL sink current, 4A GATEH sink current)
Turbo Mode load turn-on response enhancement
Programmable cycle-by-cycle over current limit protection
Phase status communicated to control IC for controlled phase timing during PSI and Phase Shedding
Power State Indicator (PSI) interface provides the capability to maximize the efficiency at light loads.
Anti-bias circuitry
Support converter output voltage up to 5.1 V (Limited to VCCL-1.8V)
Loss-less inductor current sensing
Phase delay DFF bypassed during PSI assertion mode to improve output ripple performance
Over-current protection during PSI assertion mode operation
Feed-forward voltage mode control
Integrated boot-strap synchronous PFET
Only four external components per phase
3 wire analog bus connects Control and Phase ICs (VID, Error Amp, Average Power Supply Current)
3 wire digital bus for accurate daisy-chain phase timing control without external components
Debugging function isolates phase IC from the converter
Self-calibration of PWM ramp, current sense amplifier, and current share amplifier
Single-wire bidirectional average current sharing
Small thermally enhanced 20L 4 X 4mm MLPQ package
RoHS compliant
TM
architecture results in a power supply that is smaller, less expensive, and
TM
Control IC provides a full featured and flexible way to
February 12, 2010
XPHASE3
DATA SHEET
TM
The IR3529 also
IR3529
PHASE IC

Related parts for IR3529MTRPBF

IR3529MTRPBF Summary of contents

Page 1

DESCRIPTION The IR3529 Phase IC combined with an IR XPhase3 implement power solutions for the latest high performance CPUs and ASICs. The “Control” IC provides overall system control and interfaces with any number of “Phase” ICs which each drive and ...

Page 2

... VCCL EAIN ISHARE 1 ILL ILL 2 PSI# PSI# 3 DACIN DACIN 4 LGND 5 PHSIN PHSIN SHIFT PHSOUT CLKIN ORDERING INFORMATION Part Number IR3529MTRPBF * IR3529MPBF * Samples only Page ROCSET COCSET GATEH 13 IR3529 BOOST 12 CBST VCCL 11 OCSET CVCCL1 Figure 1 Single Phase Application Circuit Package 20 Lead MLPQ ...

Page 3

ABSOLUTE MAXIMUM RATINGS Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the ...

Page 4

RECOMMENDED OPERATING CONDITIONS FOR RELIABLE OPERATION WITH MARGIN 8.0V ≤ V ≤ 16V, 4.75V ≤ CCL 250kHz ≤ PHSIN ≤1.5MHz. ELECTRICAL CHARACTERISTICS The electrical characteristics involve the spread of values guaranteed within the recommended operating conditions. Typical values ...

Page 5

PARAMETER SW Floating Voltage Measured in the application with the converter not switching. Measure after 50us of CLKIN=0 with CSINM shorted to SW Calibrated Input Offset CSIN+ = CSIN- = DACIN. Measure input Voltage referred offset from DACIN. Note1 GAIN ...

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PARAMETER OVP Comparator OVP Threshold Propagation Delay Synchronous Rectification Disable Comparator Threshold Voltage Over Current Comparator IOCSET Sink Current Propagation Delay Time Turbo Comparator Activation Threshold Voltage Turbo Pulse Width Turbo Enable Threshold Debug Comparator Threshold Voltage General VCC Supply ...

Page 7

PIN DESCRIPTION PIN# PIN SYMBOL PIN DESCRIPTION 1 ILL Output of the Current Sense Amplifier is connected to this pin through a 3k resistor. Voltage on this pin is equal to V(DACIN [V(CSIN+) – V(CSIN-)]. Connecting all ILL ...

Page 8

SYSTEM THEORY OF OPERATION System Description The system consists of one control IC and a scalable array of phase converters, each requiring one phase IC. The control IC communicates with the phase ICs using three digital buses, i.e., CLOCK, PHSIN, ...

Page 9

Frequency and Phase Timing Control The oscillator is located in the Control IC and the system clock frequency is programmable from 250 kHz to 9 MHz by an external resistor. The control IC system clock signal (CLKOUT) is connected to ...

Page 10

PHASE IC CLOCK PULSE EAIN PWMRMP VDAC GATEH GATEL STEADY-STATE OPERATION TM Body Braking In a conventional synchronous buck converter, the minimum time required to reduce the current in the inductor in response to a load step decrease is; The ...

Page 11

Usually the resistor Rcs and capacitor Ccs are chosen so that the time constant of Rcs and Ccs equals the time constant of the inductor which is the inductance L over the inductor DCR (R voltage across Ccs is proportional ...

Page 12

PWM ramp thereby decreasing its duty cycle and output current. The current share amplifier is internally compensated so that the crossover frequency of the current share ...

Page 13

A synchronous rectification disable comparator is used to detect the converter’s CSIN- pin voltage, which represents local converter output voltage. If the voltage is below 75% of VDAC and negative current is detected, GATEL is driven low, which disables synchronous ...

Page 14

Turbo Modulator The turbo functionality is included in IR3529 to improve the transient performance of the system with reduced output capacitance. The turbo modulator consists of a comparator that monitors the EAIN signal and its filtered version. The modulator turns ...

Page 15

OUTPUT OVP VOLTAGE THRESHOLD (VO) VCCL-800 mV IOUT(ISHARE) GATEH (PHASE IC) GATEL (PHASE IC) FAULT LATCH ERROR AMPLIFIER VDAC OUTPUT (EAOUT) Over Voltage Protection (OVP) The IR3529 includes over-voltage protection that turns on the low side MOSFET to protect the ...

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APPLICATIONS SCHEMATIC +12V 4.75V to 7.5V VCCL PSI# VRRDY RMON IOUT RMON1 CMON CVCCL VOSEN- 33 EXPAD 1 24 VID7 VID7 PSI VID6 VID6 ROSC 3 22 VID5 VID5 SS/DEL 4 21 VID4 VID4 VDAC IR3503 5 20 ...

Page 17

DESIGN PROCEDURES - IR3529 Inductor Current Sensing Capacitor C The DC resistance of the inductor is utilized to sense the inductor current. Usually the resistor parallel with the inductor are chosen to match the time constant of ...

Page 18

LAYOUT GUIDELINES The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB layout; therefore, minimizing the noise coupled to the IC. • Dedicate at least one middle layer for a ground plane, which is ...

Page 19

PCB Metal and Component Placement • Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be ≥ 0.2mm to minimize shorting. • Lead land length should be equal to maximum part ...

Page 20

Solder Resist • The solder resist should be pulled away from the metal lead lands and center pad by a minimum of 0.06mm. The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands ...

Page 21

Stencil Design • The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the ...

Page 22

PACKAGE INFORMATION 20L MLPQ ( Body) – θ IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 Visit us at www.irf.com for sales contact information. Page ...

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