IR3502BMTRPBF International Rectifier, IR3502BMTRPBF Datasheet - Page 35
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IR3502BMTRPBF
Manufacturer Part Number
IR3502BMTRPBF
Description
IC REG XPH INTEL VR11.1 32-MLPQ
Manufacturer
International Rectifier
Series
XPhase3™r
Datasheet
1.IR3502BMTRPBF.pdf
(38 pages)
Specifications of IR3502BMTRPBF
Package / Case
32-MLPQ
Mounting Type
Surface Mount
Current - Supply
8mA
Voltage - Supply
8 V ~ 16 V
Operating Temperature
0°C ~ 100°C
Applications
Processor
Operating Temperature (max)
150C
Operating Temperature (min)
0C
Pin Count
32
Mounting
Surface Mount
Package Type
MLPQ
Case Length
5mm
Screening Level
Commercial
Package
32-Lead MLPQ
Circuit
X-Phase Control IC
Switch Freq (khz)
250kHz to 1.5MHz
Pbf
PbF Option Available
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PCB Metal and Component Placement
Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should
Lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm
Center pad land length and width should be equal to maximum part pad length and width. However, the
Four 0.30mm diameter vias shall be placed in the center of the pad land and connected to ground to
No pcb traces should be routed nor vias placed under any of the 4 corners of the IC package. Doing so
be ≥ 0.2mm to prevent shorting.
inboard extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard
extension will accommodate any part misalignment and ensure a fillet.
minimum metal to metal spacing should be ≥ 0.17mm for 2 oz. Copper (≥ 0.1mm for 1 oz. Copper and ≥
0.23mm for 3 oz. Copper)
minimize the noise effect on the IC.
can cause the IC to rise up from the pcb resulting in poor solder joints to the IC leads.
Page 35 of 38
IR3502B
V3.2