IR3502BMTRPBF International Rectifier, IR3502BMTRPBF Datasheet - Page 36

• Manufacturer Part Number: IR3502BMTRPBF
• Description: IC REG XPH INTEL VR11.1 32-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase3™r

Specifications of IR3502BMTRPBF

• Package / Case: 32-MLPQ
• Mounting Type: Surface Mount
• Current - Supply: 8mA
• Voltage - Supply: 8 V ~ 16 V
• Operating Temperature: 0°C ~ 100°C
• Applications: Processor
• Operating Temperature (max): 150C
• Operating Temperature (min): 0C
• Pin Count: 32
• Mounting: Surface Mount
• Package Type: MLPQ
• Case Length: 5mm
• Screening Level: Commercial
• Package: 32-Lead MLPQ
• Circuit: X-Phase Control IC
• Switch Freq (khz): 250kHz to 1.5MHz
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Solder Resist
 The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
 The minimum solder resist width is 0.13mm.
 At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
 The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
 Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
 The vias in the land pad should be tented or plugged from bottom boardside with solder resist.
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
fillet so a solder resist width of ≥ 0.17mm remains.
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
aspect ratio of the solder resist strip separating the lead lands from the pad land.
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IR3502B
V3.2