NE1617ADS,112 NXP Semiconductors, NE1617ADS,112 Datasheet - Page 27
![IC TEMP MONITOR 16SSOP](/photos/6/52/65220/16-ssop_sml.jpg)
NE1617ADS,112
Manufacturer Part Number
NE1617ADS,112
Description
IC TEMP MONITOR 16SSOP
Manufacturer
NXP Semiconductors
Datasheet
1.NE1617ADS118.pdf
(27 pages)
Specifications of NE1617ADS,112
Function
Temp Monitoring System (Sensor)
Topology
ADC, Multiplexer, Register Bank
Sensor Type
External & Internal
Sensing Temperature
-55°C ~ 125°C, External Sensor
Output Type
SMBus™
Output Alarm
Yes
Output Fan
No
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-QSOP
Temperature Sensor Function
Temp Sensor
Interface Type
Serial (2-Wire)
Operating Temperature (min)
0C
Operating Temperature (max)
125C
Operating Temperature Classification
Military
Operating Supply Voltage (min)
3V
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935268119112
NE1617ADS
NE1617ADS
NE1617ADS
NE1617ADS
NXP Semiconductors
19. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
8.3.6
8.3.7
8.3.8
8.4
8.5
8.6
9
9.1
9.2
9.3
10
11
11.1
12
13
13.1
13.2
13.3
13.4
14
14.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Temperature monitor with SMBus serial
interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application design-in information . . . . . . . . . 13
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering of SMD packages . . . . . . . . . . . . . . 21
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Remote diode selection . . . . . . . . . . . . . . . . . . 5
No calibration is required . . . . . . . . . . . . . . . . . 6
Address logic . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 6
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Low power standby modes . . . . . . . . . . . . . . . . 8
Configuration register . . . . . . . . . . . . . . . . . . . . 8
External and internal temperature registers . . . 8
Conversion rate register . . . . . . . . . . . . . . . . . . 9
Temperature limit registers . . . . . . . . . . . . . . . . 9
One-shot command . . . . . . . . . . . . . . . . . . . . 10
Status register. . . . . . . . . . . . . . . . . . . . . . . . . 10
Alert interrupt . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power-up default condition . . . . . . . . . . . . . . . 11
Fault detection . . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 12
How do D+, D- work? . . . . . . . . . . . . . . . . . . . 13
What is the difference using diode
and transistor? . . . . . . . . . . . . . . . . . . . . . . . . 13
How is error reduced when necessary to
use a wire instead of the PCB trace? . . . . . . . 13
Typical performance curves . . . . . . . . . . . . . . 18
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Printed-circuit board layout consideration. . . . 23
15
16
17
17.1
17.2
17.3
17.4
18
19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Temperature monitor for microprocessor systems
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information . . . . . . . . . . . . . . . . . . . . . . 26
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Document identifier: NE1617A_4
NE1617A
Date of release: 30 July 2009
All rights reserved.