MAX6604AATA+T Maxim Integrated Products, MAX6604AATA+T Datasheet - Page 2

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MAX6604AATA+T

Manufacturer Part Number
MAX6604AATA+T
Description
IC TEMP SENSOR DDR PREC 8-TDFN
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX6604AATA+T

Function
Temp Monitoring System (Sensor)
Sensor Type
Internal
Sensing Temperature
-20°C ~ 125°C
Output Type
I²C™/SMBus™
Output Alarm
Yes
Output Fan
No
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-20°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-TDFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Topology
-
ABSOLUTE MAXIMUM RATINGS
All Input and Output Voltages ..................................-0.3V to +6V
Continuous Power Dissipation (T A = +70°C)
ESD Protection (all pins, Human Body Model) ....................±2kV
Precision Temperature Monitor for
DDR Memory Modules
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
2
Operating Supply Voltage Range
Temperature Resolution
Temperature Accuracy
Power-On Reset (POR) Threshold
POR Threshold Hysteresis
Undervoltage-Lockout Threshold
Operating Current
Standby Current
Conversion Time
Conversion Rate
DIGITAL INTERFACE (Note 2)
Log i c- Inp ut H i g h V ol tag e ( S C L, S D A)
Logic-Input Low Voltage (SCL, SDA)
Logic-Input Hysteresis (SCL, SDA)
Leakag e C ur r ent ( E V E N T, S C L, S D A,
A2, A1, A0)
Logic-Output Low Voltage
(SDA, EVENT)
Logic-Output Low Sink Current
(SDA, EVENT)
Input Capacitance (SCL, SDA)
CC
8-Pin TDFN (derate 16.7mW/°C above +70°C) ......1333.3mW
8-Pin TSSOP (derate 8.1mW/°C above +70°C) ........646.7mW
_______________________________________________________________________________________
= +2.7V to +3.6V, T
PARAMETER
A
= -20°C to +125°C, unless otherwise noted. Typical values are at V
SYMBOL
t
f
I
CONV
CONV
LEAK
V
V
V
C
V
I
OL
CC
OL
IH
IL
IN
+3V ≤ V
+3V ≤ V
+3V ≤ V
V
During conversion
V
I
V
PULL_UP
CC
IN
OL
= V
= 0.6V
falling edge
GND
CC
CC
CC
= 350µA
≤ +3.6V, +40°C ≤ T
≤ +3.6V, -20°C ≤ T
≤ +3.6V, +75°C ≤ T
or V
CONDITIONS
CC
Junction Temperature ......................................................+150°C
Operating Temperature Range .........................-20°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
A
A
A
≤ +125°C
≤ +95°C
≤ +125°C
CC
= +3.3V, T
+2.7
MIN
2.1
-1
-2
-3
-1
8
6
0.125
TYP
500
A
2.0
2.4
0.3
11
90
3
5
= +25°C.) (Note 1)
MAX
+3.6
125
0.5
0.8
+1
+2
+3
+1
50
6
UNITS
bits
mV
mA
mV
mV
mA
ms
°C
°C
µA
Hz
µA
pF
V
V
V
V
V

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