SE98TK,118 NXP Semiconductors, SE98TK,118 Datasheet - Page 33

• Manufacturer Part Number: SE98TK,118
• Description: IC TEMP SENSOR I2C 8HVSON
• Manufacturer: NXP Semiconductors

Specifications of SE98TK,118

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 1.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-HVSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3347-2; 935281692118; SE98TK-T

NXP Semiconductors
SE98_4
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 28.
Table 29.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 28
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
29
22.
Rev. 04 — 2 February 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
DDR memory module temp sensor, 3.3 V
350 to 2000
260
250
245
22) than a SnPb process, thus
220
220
350
> 2000
260
245
245
© NXP B.V. 2009. All rights reserved.
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