SE98TK,118 NXP Semiconductors, SE98TK,118 Datasheet - Page 37

• Manufacturer Part Number: SE98TK,118
• Description: IC TEMP SENSOR I2C 8HVSON
• Manufacturer: NXP Semiconductors

Specifications of SE98TK,118

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 1.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-HVSON
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3347-2; 935281692118; SE98TK-T

NXP Semiconductors
18. Contents
1
2
2.1
2.2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.3.2.1
7.3.2.2
7.3.3
7.3.3.1
7.3.3.2
7.4
7.5
7.6
7.7
7.8
7.9
7.10
8
8.1
8.2
8.3
8.4
8.5
8.5.1
8.5.2
8.5.3
8.6
8.7
8.8
8.9
9
9.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Register descriptions . . . . . . . . . . . . . . . . . . . 15
Application design-in information . . . . . . . . . 25
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
Temperature sensor features . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 5
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5
EVENT output condition . . . . . . . . . . . . . . . . . . 6
EVENT pin output voltage levels and
resistor sizing . . . . . . . . . . . . . . . . . . . . . . . . . . 6
EVENT thresholds . . . . . . . . . . . . . . . . . . . . . . 8
Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Event operation modes . . . . . . . . . . . . . . . . . . . 9
Comparator mode. . . . . . . . . . . . . . . . . . . . . . . 9
Interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . 9
Conversion rate. . . . . . . . . . . . . . . . . . . . . . . . 10
Power-up default condition . . . . . . . . . . . . . . . 10
Device initialization . . . . . . . . . . . . . . . . . . . . . 10
SMBus time-out . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus Alert . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus/I
Hot plugging . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Register overview . . . . . . . . . . . . . . . . . . . . . . 15
Capability register (00h, 16-bit read-only). . . . 16
Configuration register (01h, 16-bit read/write) 17
Temperature format . . . . . . . . . . . . . . . . . . . . 20
Temperature Trip Point registers . . . . . . . . . . . 21
Upper Boundary Alarm Trip register
(16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 21
Lower Boundary Alarm Trip register
(16-bit read/write) . . . . . . . . . . . . . . . . . . . . . . 22
Critical Alarm Trip register (16-bit read/write) . 22
Temperature register (16-bit read-only) . . . . . 23
Manufacturer’s ID register (16-bit read-only) . 23
Device ID register . . . . . . . . . . . . . . . . . . . . . . 24
SMBus register . . . . . . . . . . . . . . . . . . . . . . . . 24
SE98 in memory module application . . . . . . . 25
2
C-bus interface . . . . . . . . . . . . . . . . 12
9.2
9.3
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 26
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 30
Soldering of SMD packages . . . . . . . . . . . . . . 32
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 34
Revision history . . . . . . . . . . . . . . . . . . . . . . . 35
Legal information . . . . . . . . . . . . . . . . . . . . . . 36
Contact information . . . . . . . . . . . . . . . . . . . . 36
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Layout consideration . . . . . . . . . . . . . . . . . . . 26
Thermal considerations . . . . . . . . . . . . . . . . . 26
Introduction to soldering. . . . . . . . . . . . . . . . . 32
Wave and reflow soldering . . . . . . . . . . . . . . . 32
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 32
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 33
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 36
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 36
DDR memory module temp sensor, 3.3 V
Date of release: 2 February 2009
Document identifier: SE98_4
All rights reserved.
SE98