MCP1631HV-500E/ST Microchip Technology, MCP1631HV-500E/ST Datasheet - Page 26

• Manufacturer Part Number: MCP1631HV-500E/ST
• Description: IC INTEGRATED PWM HS 20TSSOP
• Manufacturer: Microchip Technology

Specifications of MCP1631HV-500E/ST

• Package / Case: 20-TSSOP
• Pwm Type: Current Mode
• Number Of Outputs: 1
• Frequency - Max: 2MHz
• Duty Cycle: 10%
• Voltage - Supply: 3.5 V ~ 16 V
• Buck: Yes
• Boost: No
• Flyback: No
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: Yes
• Operating Temperature: -40°C ~ 125°C
• Frequency-max: 2MHz
• Output Voltage: 3.3 V to 5 V
• Output Current: 250 mA
• Input Voltage: 3 V to 5.5 V
• Switching Frequency: 2 MHz
• Operating Temperature Range: - 40 C to + 125 C
• Mounting Style: SMD/SMT
• Frequency: 1MHz
• Digital Ic Case Style: TSSOP
• No. Of Pins: 20
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP1631RD-DCPC1 - REF DES BATT CHARG OR LED DRIVERMCP1631RD-MCC2 - REFERENCE DESIGN MCP1631HV
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP1631/HV/MCP1631V/VHV
DS22063A-page 26
20-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
E1
e
A2
Units
A2
A1
E1
L1
N
D
A
E
e
L
φ
c
b
E
c
0.05
4.30
0.45
0.19
MIN
0.80
6.40
0.09
0°
–
L1
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
6.50
0.60
20
–
–
–
–
–
Microchip Technology Drawing C04-088B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
4.50
6.60
0.75
0.20
0.30
8°
φ
L