GNM314R72A102KD01D Murata Electronics North America, GNM314R72A102KD01D Datasheet - Page 89

• Manufacturer Part Number: GNM314R72A102KD01D
• Description: CAP 4-ARRAY 1000PF 100V X7R 1206
• Manufacturer: Murata Electronics North America
• Series: GNMr

Specifications of GNM314R72A102KD01D

• Capacitance: 1000pF
• Voltage - Rated: 100V
• Dielectric Material: Ceramic
• Number Of Capacitors: 4
• Circuit Type: Isolated
• Temperature Coefficient: X7R
• Tolerance: ±10%
• Mounting Type: Surface Mount
• Package / Case: 1206 (3216 Metric)
• Height: 0.031" (0.80mm)
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 490-3421-2

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
Die Bonding/Wire Bonding (GMA Series)
1. Die Bonding of Capacitors
•Use the following materials Brazing alloy:
•Mounting
(1) Control the temperature of the substrate so
(2) Place brazing alloy on substrate and place
Au-Sn (80/20) 300 to 320 degree C in N2 atmosphere
Rating
that it matches the temperature of the brazing
alloy.
the capacitor on the alloy. Hold the capacitor
and gently apply the load. Be sure to complete
the operation in 1 minute.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
2. Wire Bonding
•Wire
•Bonding
(1) Thermocompression, ultrasonic ball bonding.
(2) Required stage temperature : 200 to 250 degree C
(3) Required wedge or capillary weight : 0.5N to 2N.
(4) Bond the capacitor and base substrate or other
Gold wire:
20 micro m (0.0008 inch), 25 micro m (0.001 inch)
diameter
devices with gold wire.
Notice
C02E.pdf
87
07.2.6
13