GNM314R72A102KD01D Murata Electronics North America, GNM314R72A102KD01D Datasheet - Page 92

CAP 4-ARRAY 1000PF 100V X7R 1206

GNM314R72A102KD01D

Manufacturer Part Number
GNM314R72A102KD01D
Description
CAP 4-ARRAY 1000PF 100V X7R 1206
Manufacturer
Murata Electronics North America
Series
GNMr
Datasheet

Specifications of GNM314R72A102KD01D

Capacitance
1000pF
Voltage - Rated
100V
Dielectric Material
Ceramic
Number Of Capacitors
4
Circuit Type
Isolated
Temperature Coefficient
X7R
Tolerance
±10%
Mounting Type
Surface Mount
Package / Case
1206 (3216 Metric)
Height
0.031" (0.80mm)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
490-3421-2
13
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
Table 3 GNM, LLA Series for Reflow Soldering Land Dimensions
Table 4 LLM Series for Reflow Soldering Land Dimensions
2. Adhesive Application
90
Notice
GNMpp2
LLM
GNM, LLA Series for Reflow Soldering Method
LLM Series for Reflow Soldering Method
Thin or insufficient adhesive causes chips to loosen or
Low viscosity adhesive causes chips to slip after
become disconnected when flow soldered. The amount
of adhesive must be more than dimension c shown in the
drawing at right to obtain enough bonding strength.
The chip's electrode thickness and land thickness must
be taken into consideration.
mounting. Adhesive must have a viscosity of 5000Pa
(500ps) min. (at 25D)
Adhesive Coverage*
Continued from the preceding page.
GRM18, GQM18
GRM21, LLL21, GQM21
GRM31, LLL31
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Part Number
Part Number
Part Number
GNM1M2
GNM212
GNM214
GNM314
e
LLA18
LLA21
LLA31
LLM21
LLM31
a
Chip Capacitor
c
p
Chip Capacitor
p
d
f
0.6 to 0.8
Adhesive Coverage*
Land
1.0
c
1.37
a
2.0
2.0
3.2
1.6
2.0
3.2
L
0.05mg min.
0.15mg min.
0.1mg min.
b'
a
b
b
b=(c-e)/2, b'=(d-f)/2
c'
*Nominal Value
(0.3 to 0.5)
(0.3 to 0.5)
b, b'
1.25
1.25
1.25
1.0
1.6
0.8
1.6
W
s
c, c'
0.3
0.4
0.4 to 0.5
0.6 to 0.7
0.6 to 0.7
0.8 to 1.0
0.3 to 0.4
0.7 to 0.8
0.8 to 1.0
GNMpp4
LLA
a
Dimensions (mm)
Dimensions (mm)
2.0 to 2.6
3.2 to 3.6
Board
d
0.35 to 0.45
0.25 to 0.4
0.5 to 0.7
0.5 to 0.7
0.7 to 0.9
0.4 to 0.6
0.7 to 0.9
b
c
1.3 to 1.8
1.6 to 2.0
Chip Capacitor
Chip Capacitor
e
Land
p
Adhesive
0.25 to 0.35
0.3 to 0.35
0.2 to 0.28
0.4 to 0.5
0.3 to 0.4
0.2 to 0.3
0.3 to 0.4
Continued on the following page.
1.4 to 1.6
c
Land
2.6
f
a : 20 to 70 m
b : 30 to 35 m
c : 50 to 105 m
a
b
a
b
0.64
c
1.0
0.5
0.8
0.4
0.5
0.8
p
0.5
0.8
p
C02E.pdf
07.2.6

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