ISL6217CVZ-T Intersil, ISL6217CVZ-T Datasheet - Page 19

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ISL6217CVZ-T

Manufacturer Part Number
ISL6217CVZ-T
Description
IC CTRLR PWM INTEL PENT 38-TSSOP
Manufacturer
Intersil
Datasheet

Specifications of ISL6217CVZ-T

Applications
Controller, Intel Pentium® IMVP-IV, IMVP+
Voltage - Input
5.5 ~ 25 V
Number Of Outputs
1
Operating Temperature
-10°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
38-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Output
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ISL6217CVZ-T
Manufacturer:
INTER
Quantity:
2 500
Part Number:
ISL6217CVZ-T
Manufacturer:
NS
Quantity:
2 500
Company:
Part Number:
ISL6217CVZ-T
Quantity:
2 500
Thin Shrink Small Outline Plastic
Packages (TSSOP)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the
reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by
Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs
4. Dimension “E1” does not include interlead flash or protrusions. Inter
5. The chamfer on the body is optional. If it is not present, a visual inde
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable damba
0.10(0.004)
JEDEC MO-153-BD-1, Issue F.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
feature must be located within the crosshatched area.
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen
sion at maximum material condition. Minimum space between protru
sion and adjacent lead is 0.07mm (0.0027 inch).
are not necessarily exact. (Angles in degrees)
2
-A-
INDEX
AREA
3
e
0.05(0.002)
b
D
M
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
C A
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality.
SEATING PLANE
M
For information regarding Intersil Corporation and its products, see www.intersil.com
E1
-C-
19
-B-
B S
A
E
A1
α
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
0.010
A2
0.25
M
B
M
L
c
ISL6217
M38.173
38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-153-BD-1 ISSUE F)
SYMBOL
A1
A2
E1
D
N
α
A
b
e
L
c
E
0.002
0.031
0.0075
0.0035
0.378
0.169
0.246
0.0177
MIN
0
0.0197 BSC
-
o
INCHES
38
0.047
0.006
0.051
0.0106
0.0079
0.386
0.177
0.256
0.0295
MAX
8
o
0.05
0.80
0.17
0.09
9.60
4.30
6.25
0.45
MILLIMETERS
MIN
0
-
0.500 BSC
o
38
1.20
0.15
1.05
0.27
0.20
9.80
4.50
6.50
0.75
MAX
8
o
Rev. 01/03
NOTES
9
3
4
6
7
-
-
-
-
-
-
-

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