LM20343MH/NOPB National Semiconductor, LM20343MH/NOPB Datasheet - Page 17

• Manufacturer Part Number: LM20343MH/NOPB
• Description: IC REG SYNC BUCK 3A 20TSSOP
• Manufacturer: National Semiconductor
• Series: PowerWise®r
• Type: Step-Down (Buck)r

Specifications of LM20343MH/NOPB

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 32 V
• Current - Output: 3A
• Frequency - Switching: 250kHz, 750kHz
• Voltage - Input: 4.5 ~ 36 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP Exposed Pad, 20-eTSSOP, 20-HTSSOP
• Primary Input Voltage: 36V
• No. Of Outputs: 1
• Output Voltage: 32V
• Output Current: 3A
• No. Of Pins: 20
• Operating Temperature Range: -40°C To +125°C
• Msl: MSL 1 - Unlimited
• Filter Terminals: SMD
• Rohs Compliant: Yes
• For Use With: LM20343EVAL - EVALUATION BOARD FOR THE LM20343
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Other names: *LM20343MH; *LM20343MH/NOPB; LM20343MH

the converter and can improve efficiency. Voltage accuracy
at the load is important so make sure feedback voltage sense
is made at the load. Doing so will correct for voltage drops at
the load and provide the best output accuracy.
6. Provide adequate device heatsinking. For most 3A designs
a four layer board is recommended. Use as many vias as is
possible to connect the EP to the power plane heatsink. For
FIGURE 13. Schematic of LM20343 Highlighting Layout Sensitive Nodes
17
best results use a 5x4 via array with a minimum via diameter
of 12 mils. "Via tenting" with the solder mask may be neces-
sary to prevent wicking of the solder paste applied to the EP.
See the Thermal Considerations section to ensure enough
copper heatsinking area is used to keep the junction temper-
ature below 125°C.
30051746
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