HCPL-2212-000E Avago Technologies US Inc., HCPL-2212-000E Datasheet - Page 6
![OPTOCOUPLER LOGIC-OUT 5MBD 8-DIP](/photos/7/66/76618/516-8-dip_sml.jpg)
HCPL-2212-000E
Manufacturer Part Number
HCPL-2212-000E
Description
OPTOCOUPLER LOGIC-OUT 5MBD 8-DIP
Manufacturer
Avago Technologies US Inc.
Type
Logicr
Datasheet
1.HCPL-0201-500E.pdf
(18 pages)
Specifications of HCPL-2212-000E
Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
5MBd
Propagation Delay High - Low @ If
150ns @ 3mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Through Hole
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
25 mA
Maximum Fall Time
0.007 us
Maximum Forward Diode Current
10 mA
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
5 MBd(Typ)
Maximum Forward Diode Voltage
1.7 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
210 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Package Type
8-Pin DIP
No. Of Channels
1
Optocoupler Output Type
Logic Gate
Input Current
5mA
Output Voltage
20V
Opto Case Style
DIP
No. Of Pins
8
Common Mode Ratio
10K
Current Rating
5mA
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1651-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-2212-000E
Manufacturer:
AVAGO
Quantity:
5 000
Part Number:
HCPL-2212-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11)
Solder Reflow Temperature Profile
6
TEMPERATURE
(0.071 ± 0.006)
1.80 ± 0.15
ROOM
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
1
8
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
6
3
BSC
2.54
4
5
50
(0.061)
MAX.
1.55
3 °C + 1 °C/–0.5 °C
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
150 °C, 90 + 30 SEC.
PREHEATING TIME
MAX.
(0.030 ± 0.010)
0.75 ± 0.25
2.5 C ± 0.5 °C/SEC.
100
LAND PATTERN RECOMMENDATION
TIME (SECONDS)
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
245 °C
TEMP.
PEAK
1.00 ± 0.15
12.30 ± 0.30
(0.433)
11.00
150
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
7
o
NOM.
50 SEC.
(0.534)
SOLDERING
13.56
(0.010
0.254
200 °C
TIME
200
- 0.0051
+ 0.003)
+ 0.076
- 0.002)
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250