HCPL-7710-000E Avago Technologies US Inc., HCPL-7710-000E Datasheet - Page 5

• Manufacturer Part Number: HCPL-7710-000E
• Description: OPTOCOUPLER CMOS 12MBD 8-DIP
• Manufacturer: Avago Technologies US Inc.
• Type: Logicr

Specifications of HCPL-7710-000E

• Package / Case: 8-DIP (0.300", 7.62mm)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 10mA
• Data Rate: 12.5MBd
• Propagation Delay High - Low @ If: 20ns
• Input Type: Logic
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Through Hole
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 10 mA
• Maximum Fall Time: 0.008 us
• Maximum Forward Diode Current: 10 mA
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 12.5 MBd
• Maximum Power Dissipation: 150 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Package Type: 8-Pin DIP
• No. Of Channels: 1
• Optocoupler Output Type: Gate Drive
• Input Current: 10µA
• Output Voltage: 5V
• Opto Case Style: DIP
• No. Of Pins: 8
• Common Mode Ratio: 10000
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1480-5

5
Recommended Pb-Free IR Profile
Regulatory Information
The HCPL-x710 have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition
program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
Insulation and Safety Related Specifications
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed circuit
board, minimum creepage and clearance requirements
must be met as specified for individual equipment stan-
dards. For creepage, the shortest distance path along the
Parameter
Minimum External Air
Gap (Clearance)
Minimum External
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
Note: Non-halide flux should be used.
smax
smin
25
T
T
p
L
= 200 °C, T
150 - 200 °C
217 °C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
s
260 +0/-5 °C
TIME
Symbol
L(I01)
L(I02)
CTI
t
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
7710
7.1
7.4
0.08
≥175
IIIa
RAMP-DOWN
6 °C/SEC. MAX.
Value
0710
4.9
4.8
0.08
≥175
IIIa
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
surface of a printed circuit board between the solder fillets
of the input and output leads must be considered. There
are recommended techniques such as grooves and ribs
which may be used on a printed circuit board to achieve
desired creepage and clearances. Creepage and clearance
distances will also change depending on factors such as
pollution degree and insulation level.
Volts
Units
mm
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)