PS9711 NEC, PS9711 Datasheet
PS9711
Specifications of PS9711
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PS9711 Summary of contents
Page 1
... HIGH SPEED 10 Mbps, TOTEM-POLE OUTPUT TYPE DESCRIPTION The PS9711 is an optically coupled high speed totem pole isolator containing a GaAIAs LED on the light emitting diode side (input side) and a photodiode and a signal processing circuit on the light receiving side (output side) on one chip housed in a plastic SOP (Small Out-Line Package) for high density applications ...
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... High Level Input Current mA 7.5 Low Level Input Current 0 µA Supply Voltage V 4.5 TTL → kΩ TTL PACKAGE PACKING STYLE 5 Pin SOP Magazine case 100 pcs Embossed Tape 900 pcs/reel Embossed Tape 3500 pcs/reel PS9711 (ON) 100 0 PS9711 12.5 250 5.0 5.5 3 ...
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... PS9711 OUTLINE DIMENSIONS (Units in mm) PS9711 4.0±0.5 +0.10 0.4 0.25 M -0.05 2.1±0.2 0.1 ± 0.1 1.27 1.2 MAX TYPICAL PERFORMANCE CURVES MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE Ambient Temperature, T FORWARD CURRENT vs. FORWARD VOLTAGE 100 100 ˚ ˚C 1.0 25 ˚C 0 ˚C -25 ˚ ...
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... PS9711 TYPICAL PERFORMANCE CURVES HIGH LEVEL OUTPUT VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT 250 µ +85°C A +25°C -40° High Level Output Current I LOW LEVEL OUTPUT VOLTAGE vs. LOW LEVEL OUTPUT CURRENT 4 +85°C A +25°C 1 -40° Low Level Output Current I PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs ...
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... Packing: 900 pcs/reel (T = 25°C unless otherwise specified 100 (°C) A (Units in mm) TAPE DIRECTION 1.75±0.1 2.4±0.1 5.5±0.1 12±0.2 7.4±0.1 0.3 REEL OUTLINE AND DIMENSIONS 2.0±0.5 φ13.0±0.5 15° 15° φ21.0±0.8 PS9711-E3 PS9711-E4 2.0 13.0±1.0 ...
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... TAPE DIRECTION 1.75±0.1 2.4±0.1 5.5±0.1 12±0.2 7.4±0.1 0.3 REEL OUTLINE AND DIMENSIONS φ21.0 ± 0.8 2.0 ± 0.5 1.5 ± 0.5 6.0 ± 1 PS9711-F3 PS9711-F4 1.5 ± 0.1 1.5 ± 0.1 +2.0 12.4 -0.0 18.4 MAX ...
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... PS9711 RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature • Time of temperature higher than 210 ˚C • Number of reflows • Flux 100 to 160 ˚C (2) Dip soldering • Temperature 260 ˚C or below (molten solder temperature) • Time 10 seconds or less • Number of times One (Allowed to be dipped in solder including plastic mold portion.) • ...