MT18VDDF6472DY-335G2 Micron Technology Inc, MT18VDDF6472DY-335G2 Datasheet - Page 23

• Manufacturer Part Number: MT18VDDF6472DY-335G2
• Description: MODULE DDR 512MB 184-DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT18VDDF6472DY-335G2

• Memory Type: DDR SDRAM
• Memory Size: 512MB
• Speed: 333MT/s
• Package / Case: 184-DIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 184RDIMM
• Device Core Size: 72b
• Organization: 64Mx72
• Total Density: 512MByte
• Chip Density: 256Mb
• Access Time (max): 600ps
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.6V
• Operating Current: 1.611A
• Number Of Elements: 18
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.5V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 184
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 16: Register Timing Requirements and Switching Characteristics
Note: 1
NOTE:
pdf: 09005aef80f6b913, source: 09005aef80f6b41c
DDAF18C64_128x72G.fm - Rev. C 9/04 EN
1. The timing and switching specifications for the register listed above are critical for proper operation of DDR SDRAM
2. Data inputs must be low a minimum time of t
3. Data and clock inputs must be held at valid levels (not floating) a minimum time of t
4. For data signal input slew rate
5. For data signal input slew rate
6. CK, CK# signals input slew rate
or JESD82-4)
by JESD82-3
(bit pattern
REGISTER
Registered DIMMs. These are meant to be a subset of the parameters for the specific device used on the module.
Detailed information for this register is available in JEDEC Standard JESD82.
LOW.
SSTL
SYMBOL
f
t
clock
t
t
t
inact
t
t
t
PHL
act
pd
su
w
h
Differential Inputs Active Time
Setup Time, Slow Slew Rate
Differential Inputs Inactive
Setup Time, Fast Slew Rate
Hold Time, Slow Slew Rate
Hold Time, Fast Slew Rate
Clock to Output Time
Reset to Output Time
Clock Frequency
PARAMERTER
Pulse Duration
0.5 V/ns and
1 V/ns.
1V/ns.
Time
act
1V/ns.
max, after RESET# is taken HIGH.
Data After CK HIGH,
30pF to GND and
CK, CK# HIGH or
HIGH, CK# LOW
Data Before CK
23
CONDITION
50 to V
512MB, 1GB (x72, ECC, SR) PC3200
CK# LOW
LOW
TT
Micron Technology, Inc., reserves the right to change products or specifications without notice.
184-PIN DDR SDRAM RDIMM
V
0°C
DD
MIN
0.75
0.90
0.75
0.90
1.1
2.5
60
-
-
-
= +2.6V ±0.1V
T
A
inact
+70°C
max, after RESET# is taken
MAX
220
2.8
22
22
5
-
-
-
-
-
©2004 Micron Technology, Inc. All rights reserved.
UNITS
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTES
4, 6
5, 6
4, 6
5, 6
2
3