MT18VDDT6472AG-335G4 Micron Technology Inc, MT18VDDT6472AG-335G4 Datasheet - Page 29
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MT18VDDT6472AG-335G4
Manufacturer Part Number
MT18VDDT6472AG-335G4
Description
MODULE SDRAM DDR 512MB 184DIMM
Manufacturer
Micron Technology Inc
Specifications of MT18VDDT6472AG-335G4
Memory Type
DDR SDRAM
Memory Size
512MB
Speed
333MT/s
Package / Case
184-DIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
184UDIMM
Device Core Size
72b
Organization
64Mx72
Total Density
512MByte
Chip Density
256Mb
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Operating Current
1.611A
Number Of Elements
18
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
184
Mounting
Socket
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
NOTE:
pdf: 09005aef808a331f, source: 09005aef80858037
DD18C32_64_128_256x72G.fm - Rev. E 9/04 EN
1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM) across the module.
2. The component case temperature measurements shown above were obtained experimentally. The typical system to be
3. Temperature versus air speed data is obtained by performing experiments with the system motherboard removed from
4. The memory diagnostic software used for determining worst-case component temperatures is a memory diagnostic soft-
used for experimental purposes is a dual-processor 600 MHz work station, fully loaded, with four comparable registered
memory modules. Case temperatures charted represent worst-case component locations on modules installed in the
internal slots of the system.
its case and mounted in a Eiffel-type low air speed wind tunnel. Peripheral devices installed on the system motherboard
for testing are the processor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel test
chamber.
ware application developed for internal use by Micron Technology, Inc.
100
90
80
70
60
50
40
30
20
Figure 12: Component Case Temperature vs. Air Flow
T
T
max
ave
- memory stress software
- memory stress software
T
256MB, 512MB, 1GB, 2GB (x72, ECC, SR)
ave
Air Flow (meters/sec)
- 3D gaming software
29
Micron Technology, Inc., reserves the right to change products or specifications without notice.
184-PIN DDR SDRAM RDIMM
Ambient Temperature = 25º C
Minimum Air Flow
©2004 Micron Technology, Inc. All rights reserved.