HYS64T64000HU-3S-B Qimonda, HYS64T64000HU-3S-B Datasheet
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HYS64T64000HU-3S-B
Specifications of HYS64T64000HU-3S-B
Related parts for HYS64T64000HU-3S-B
HYS64T64000HU-3S-B Summary of contents
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HYS64T32x00HU–[25F/2.5/3/3S/3.7/5]–B HYS[64/72]T64x00HU–[25F/2.5/3/3S/3.7/5]–B HYS[64/72]T128x20HU–[25F/2.5/3/3S/3.7/5]– ...
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... Added WhiteBox Products for Speed Grade –3S and –3.7 to IDD tables. 70, 74, 78, Updated SPD codes for –3S and –3.7 WhiteBox Products. 82 Previous Revision: 2006-09, Rev. 1.21 All Qimonda update Previous Revision: 2006-06, Rev. 1.2 43 SPD codes updated Previous Revision: 2006-01, Rev. 1.1 3 ...
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... Overview This chapter gives an overview of the 240-Pin unbuffered DDR2 SDRAM Modules product family and describes its main characteristics. 1.1 Features Feature list and performance tables • 240-Pin PC2–6400, PC2–5300, PC2–4200 and PC2–3200 DDR2 SDRAM memory modules. • 32M × 64, 64M × 64, 64M × 72, 128M × 64 and 128M ×72 module organization and 32M × ...
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... MB 1R×16 PC2–5300U–555–12–C1 HYS64T32900HU–3S–B 256 MB 1R×16 PC2–5300U–555–12–C1 HYS64T64000HU–3S–B 512 MB 1R×8 PC2–5300U–555–12–D0 HYS64T64900HU–3S–B 512 MB 1R×8 PC2–5300U–555–12–D0 HYS72T64000HU– ...
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... GB 2R×8 PC2–3200E–333–12–G0 1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS64T64000HU–3.7–B, indicating Rev. “B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see sheet. 2) The Compliance Code is printed on the module label and describes the speed grade, for example “ ...
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... GByte 2 128M × GByte 2 1) Product Type DRAM Components HYS64T32000HU HYB18T512160BF HYS64T32900HU HYS64T64000HU HYB18T512800BF HYS64T64900HU HYS72T64000HU HYB18T512800BF HYS64T128020HU HYB18T512800BF HYS64T128920HU HYS72T128020HU HYB18T512800BF 1) Green Product 2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet. ...
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... Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 SDRAM Module and Table 7 respectively. The pin numbering is depicted in Figure 1 for non-ECC modules (×64) and modules (×72). Table 6 Function Clock Signals 2:0, Complement Clock Signals 2:0 Clock Enable Rank 1:0 Note: 2 Ranks module Not Connected ...
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... Note: 1 Gbit based module and 512M Not Connected × Note: Module based on 1 Gbit 16 × Module based on 512 Mbit 16 or smaller Address Signal 14 Note: Modules based on 2 Gbit Not Connected Note: Modules based on 1 Gbit or smaller Data Bus 63:0 Data Input/Output pins 8 Internet Data Sheet ...
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Ball No. Name Pin Buffer Type Type 12 DQ8 I/O SSTL 13 DQ9 I/O SSTL 21 DQ10 I/O SSTL 22 DQ11 I/O SSTL 131 DQ12 I/O SSTL 132 DQ13 I/O SSTL 140 DQ14 I/O SSTL 141 DQ15 I/O SSTL 24 ...
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Ball No. Name Pin Buffer Type Type 98 DQ48 I/O SSTL 99 DQ49 I/O SSTL 107 DQ50 I/O SSTL 108 DQ51 I/O SSTL 217 DQ52 I/O SSTL 218 DQ53 I/O SSTL 226 DQ54 I/O SSTL 227 DQ55 I/O SSTL 110 ...
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Ball No. Name Pin Buffer Type Type 167 CB6 I/O SSTL NC NC — 168 CB7 I/O SSTL NC NC — Data Strobe Bus 7 DQS0 I/O SSTL 16 DQS1 I/O SSTL 28 DQS2 I/O SSTL 37 DQS3 I/O SSTL ...
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... Serial Address Select Bus 2:0 I/O Reference Voltage EEPROM Power Supply I/O Driver Power Supply Power Supply Ground Plane On-Die Termination Control 0 On-Die Termination Control 1 Note: 2 Rank modules Not Connected Note: 1 Rank modules Not connected Note: Pins not connected on Qimonda UDIMMs 12 Internet Data Sheet ...
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Abbreviation Description I Standard input-only pin. Digital levels. O Output. Digital levels. I/O I bidirectional input/output signal. AI Input. Analog levels. PWR Power GND Ground NC Not Connected Abbreviation Description SSTL Serial Stub Terminated Logic (SSTL_18) LV-CMOS Low ...
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Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 SDRAM Module Pin Configuration UDIMM ×64 (240 Pin) 14 Internet Data Sheet FIGURE 1 ...
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Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 SDRAM Module Pin Configuration UDIMM ×72 (240 Pin) 15 Internet Data Sheet FIGURE 2 ...
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Electrical Characteristics This chapter describes the Electrical Characteristics. 3.1 Absolute Maximum Ratings Caution is needed not to exceed absolute maximum ratings of the DRAM device listed in Symbol Parameter V V Voltage on pin relative ...
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DC Operating Conditions This chapter contains the DC Operating Conditions tables. Parameter Operating temperature (ambient) DRAM Case Temperature Storage Temperature Barometric Pressure (operating & storage) Operating Humidity (relative) 1) DRAM Component Case Temperature is the surface temperature in the ...
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Timing Characteristics This chapter describes the AC Characteristics. 3.3.1 Speed Grade Definitions All Speed grades faster than DDR2-DDR400B comply with DDR2-DDR400B timing specifications( Speed Grade Definition for: DDR2–800(Table Speed Grade QAG Sort Name CAS-RCD-RP latencies Parameter Clock Frequency @ ...
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Speed Grade QAG Sort Name CAS-RCD-RP latencies Parameter Row Active Time Row Cycle Time RAS-CAS-Delay Row Precharge Time 1) Timings are guaranteed with CK/CK differential Slew Rate of 2.0 V/ns. For DQS signals timings are guaranteed with a differential Slew ...
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Speed Grade QAG Sort Name CAS-RCD-RP latencies Parameter Clock Frequency @ Row Active Time Row Cycle Time RAS-CAS-Delay Row Precharge Time 1) Timings are guaranteed with CK/CK differential Slew ...
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... Exit precharge power-down to any valid command (other than NOP or Deselect) Exit self-refresh to a non-read command Exit self-refresh to read command Write command to DQS associated clock edges 1) For details and notes see the relevant Qimonda component data sheet 1.8 V ± 0.1V 1.8 V ± 0.1 V. See notes ...
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Timing that is not specified is illegal and after such an event, in order to guarantee proper operation, the DRAM must be powered down and then restarted through the specified initialization sequence before normal operation can continue. 4) Timings ...
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QH HP QHS HP max column. {The less half-pulse width distortion present, the larger the t Examples: ...
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... Exit precharge power-down to any valid command (other than NOP or Deselect) Exit self-refresh to a non-read command Exit self-refresh to read command Write command to DQS associated clock edges 1) For details and notes see the relevant Qimonda component data sheet 1.8 V ± 0.1V; = 1.8 V ± 0.1 V. See notes ...
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New units, ‘ ‘ and ‘nCK‘, are introduced in DDR2–667 and DDR2–800. Unit ‘ CK.AVG under operation. Unit ‘nCK‘ represents one clock cycle of the input clock, counting the actual clock edges. Note that in DDR2–400 and t ...
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RPST RPRE begins driving ( ). Figure 3 RPST ...
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Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 SDRAM Module Method for calculating transitions and endpoint Differential input waveform timing - t Differential input waveform timing - t 27 Internet Data Sheet FIGURE 3 FIGURE 4 and FIGURE ...
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Parameter DQ output access time from CAS A to CAS B command period CK, CK high-level width CKE minimum high and low pulse width CK, CK low-level width Auto-Precharge write recovery + precharge time Minimum time clocks ...
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... Exit precharge power-down to any valid command (other than NOP or Deselect) Exit Self-Refresh to non-Read command Exit Self-Refresh to Read command Write recovery time for write with Auto- Precharge 1) For details and notes see the relevant Qimonda component data sheet = 1.8 V ± 0 1.8 V ±0.1 V. See notes ...
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The , and , parameters are referenced to a specific voltage level, which specify when the device output is no longer driving HZ RPST LZ RPRE begins ...
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Parameter DQ output access time from CAS A to CAS B command period CK, CK high-level width CKE minimum high and low pulse width CK, CK low-level width Auto-Precharge write recovery + precharge time Minimum time clocks ...
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... Exit precharge power-down to any valid command (other than NOP or Deselect) Exit Self-Refresh to non-Read command Exit Self-Refresh to Read command Write recovery time for write with Auto- Precharge 1) For details and notes see the relevant Qimonda component data sheet = 1.8 V ± 0 1.8 V ±0.1 V. See notes ...
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The , and , parameters are referenced to a specific voltage level, which specify when the device output is no longer driving HZ RPST LZ RPRE begins ...
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ODT AC Character. and Operating Conditions for DDR2-533 & DDR2-400 Symbol Parameter / Condition t ODT turn-on delay AOND t ODT turn-on AON t ODT turn-on (Power-Down Modes) AONPD t ODT turn-off delay AOFD t ODT turn-off AOF t ODT ...
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I Specifications and Conditions DD I List of tables defining Specifications and Conditions. DD • Table 22 “IDD Measurement Conditions” on Page 35 • Table 23 “Definitions for IDD” on Page 36 • Table 25 “IDD Specification for HYS[64/72]T[32/64/128]0x0HU-2.5-B” ...
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... Definitions for see Table For two rank modules: for all active current measurements the other rank is in Precharge Power-Down Mode 5) For details and notes see the relevant Qimonda component data sheet and current measurements are defined with the outputs disabled ( ...
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Product Type Organization 256MB 512MB 1 Rank 1 Rank ×64 ×64 -25F -25F Symbol Max. Max. I 420 670 DD0 I 480 800 DD1 DD2P I 200 410 DD2N I 180 360 DD2Q I 160 310 DD3P( ...
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Product Type Organization 256MB 1 Rank ×64 -2.5 Symbol Max. I 400 DD0 I 460 DD1 I 30 DD2P I 200 DD2N I 180 DD2Q I 160 DD3P( MRS = DD3P( MRS = 1) I 240 DD3N ...
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Product Type Organization 256MB 512MB 1 Rank 1 Rank ×64 × Symbol Max. Max. I 380 600 DD0 I 420 720 DD1 DD2P I 180 360 DD2N I 160 320 DD2Q I 130 260 DD3P( ...
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Product Type Organization 256MB 512MB 1 Rank 1 Rank ×64 ×64 -3S -3S Symbol Max. Max. I 360 570 DD0 I 400 680 DD1 DD2P I 180 360 DD2N I 160 320 DD2Q I 130 260 DD3P( ...
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Product Type Organization 256MB 512MB 1 Rank 1 Rank ×64 ×64 -3.7 -3.7 Symbol Max. Max. I 320 520 DD0 I 360 600 DD1 DD2P I 150 300 DD2N I 140 280 DD2Q I 110 220 DD3P( ...
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Product Type Organization 256MB 512MB 1 Rank 1 Rank ×64 × Symbol Max. Max. I 300 490 DD0 I 330 560 DD1 DD2P I 140 270 DD2N I 130 260 DD2Q I 100 190 DD3P( ...
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SPD Codes This chapter lists all hexadecimal byte values stored in the EEPROM of the products described in this data sheet. SPD stands for serial presence detect. All values with XX in the table are module specific bytes which ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 7 Not used 8 Interface Voltage Level (Byte 18) [ns] CK MAX t 10 SDRAM @ CL (Byte 18) [ns] AC MAX 11 Error Correction Support ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 31 Module Density per Rank and [ns] AS.MIN CS.MIN and [ns] AH.MIN CH.MIN t 34 [ns] DS.MIN t 35 [ns] DH.MIN t 36 [ns] ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ T (DT4R) / ∆ Sign (DT4R4W) 4R 4R4W ∆ (DT5B) 5B ∆ (DT7 Psi(ca) PLL 59 Psi(ca) REG ∆ ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 79 Product Type, Char 7 80 Product Type, Char 8 81 Product Type, Char 9 82 Product Type, Char 10 83 Product Type, Char 11 84 Product Type, Char 12 ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 21 DIMM Attributes 22 Component Attributes (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description t 45 [ns] QHS.MAX 46 PLL Relock Time T Delta / ∆ Delta CASE.MAX 4R4W 48 Psi(T-A) DRAM ∆ (DT0) 0 ∆ T (DT2N, UDIMM) or ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 69 Manufacturer’s JEDEC ID Code (6) 70 Manufacturer’s JEDEC ID Code (7) 71 Manufacturer’s JEDEC ID Code (8) 72 Module Manufacturer Location 73 Product Type, Char 1 74 Product Type, ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 93 Module Manufacturing Date Year 94 Module Manufacturing Date Week Module Serial Number 99 - 127 Not used 128 - Blank for customer use 255 Rev. 1.3, ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 22 Component Attributes (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 46 PLL Relock Time Delta / ∆ Delta CASE.MAX 4R4W 48 Psi(T-A) DRAM ∆ (DT0) 0 ∆ T (DT2N, UDIMM) or ∆ ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 70 Manufacturer’s JEDEC ID Code (7) 71 Manufacturer’s JEDEC ID Code (8) 72 Module Manufacturer Location 73 Product Type, Char 1 74 Product Type, Char 2 75 Product Type, Char ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 94 Module Manufacturing Date Week Module Serial Number 99 - 127 Not used 128 - Blank for customer use 255 Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ (DT0) 0 ∆ T (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 75 Product Type, Char 3 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ (DT0) 0 ∆ T (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 75 Product Type, Char 3 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ (DT0) 0 ∆ (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 75 Product Type, Char 3 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] CK MAX t ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description ∆ (DT0) 0 ∆ (DT2N, UDIMM) or ∆ ∆ (DT2P) 2P ∆ (DT3N) 3N ∆ (DT3P fast) ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 75 Product Type, Char 3 76 Product Type, Char 4 77 Product Type, Char 5 78 Product Type, Char 6 79 Product Type, Char 7 80 Product Type, Char 8 ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 0 Programmed SPD Bytes in EEPROM 1 Total number of Bytes in EEPROM 2 Memory Type (DDR2) 3 Number of Row Addresses 4 Number of Column Addresses 5 DIMM Rank ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 22 Component Attributes (Byte 18) [ns] CK MAX t 24 SDRAM @ CL -1 [ns] AC MAX (Byte 18) [ns] ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 46 PLL Relock Time Delta / ∆ Delta CASE.MAX 4R4W 48 Psi(T-A) DRAM ∆ (DT0) 0 ∆ T (DT2N, UDIMM) or ∆ ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 70 Manufacturer’s JEDEC ID Code (7) 71 Manufacturer’s JEDEC ID Code (8) 72 Module Manufacturer Location 73 Product Type, Char 1 74 Product Type, Char 2 75 Product Type, Char ...
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Product Type Organization Label Code JEDEC SPD Revision Byte# Description 94 Module Manufacturing Date Week Module Serial Number 99 - 127 Not used 128 - Blank for customer use 255 Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 ...
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Package Outlines This chapter contains the Package Outline tables. Notes 1. Drawing according to ISO 8015 2. Dimensions General tolerances +/- 0.15 Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 SDRAM Module Package Outline Raw Card C ...
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Notes 1. Drawing according to ISO 8015 2. Dimensions General tolerances +/- 0.15 Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 SDRAM Module Package Outline Raw Card D L-DIM-240-8 80 Internet Data Sheet FIGURE 7 ...
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Notes 1. Drawing according to ISO 8015 2. Dimensions General tolerances +/- 0.15 Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 SDRAM Module Package Outline Raw Card E L-DIM-240-9 81 Internet Data Sheet FIGURE 8 ...
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Notes 1. Drawing according to ISO 8015 2. Dimensions General tolerances +/- 0.15 Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 SDRAM Module Package Outline Raw Card F L-DIM-240-6 82 Internet Data Sheet FIGURE 9 ...
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Notes 1. Drawing according to ISO 8015 2. Dimensions General tolerances +/- 0.15 Rev. 1.3, 2006-12 03292006-6GMD-RSFT HYS[64/72]T[32/64/128]xx0HU-[25F/2.5/3/3S/3.7/5]-B Unbuffered DDR2 SDRAM Module Package Outline Raw Card G L-DIM-240-7 83 Internet Data Sheet FIGURE 10 ...
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... Product Type Nomenclature Qimonda’s nomenclature uses simple coding combined with some propriatory coding. Table 38 provides examples for module and component product type number as well as the Example for Field Number 1 2 Micro-DIMM HYS 64 DDR2 DRAM HYB 18 Field Description 1 Qimonda Module Prefix ...
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... Multiplying “Memory Density per I/O” with “Module Data Width” and dividing by 8 for Non-ECC and 9 for ECC modules gives the overall module memory density in MBytes as listed in column “Coding”. Field Description 1 Qimonda Component Prefix 2 Interface Voltage [V] 3 DRAM Technology ...
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Table of Contents 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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... With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Qimonda hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. ...