HFBR-57E0APZ Avago Technologies US Inc., HFBR-57E0APZ Datasheet - Page 10

• Manufacturer Part Number: HFBR-57E0APZ
• Description: TXRX MM SFP LC CONN BAIL DELATCH
• Manufacturer: Avago Technologies US Inc.
• Series: -r

Specifications of HFBR-57E0APZ

• Applications: Ethernet
• Mounting Type: SFP
• Voltage - Supply: 2.97 V ~ 3.63 V
• Connector Type: LC Duplex
• Wavelength: 1300nm
• Data Rate: 155MBd
• Supply Voltage: 3.3V
• Wavelength Typ: 1300nm
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Figure 8. SFP host board mechanical layout
16.25
10
9.6
REF . 14.25
MIN. PITCH
10.93
Y
16.25
∅ 0.1 L A S B S
11.08
3
0.8
TYP .
4
PCB
EDGE
8.58
2x 1.55 ± 0.05
11x
2.0
5.68
X
PIN 1
10
B
3.2
DET AIL 1
5
20
11
0.9
10x ∅1.05 ± 0.01
∅ 0.1 L X A S
26.8
2 ± 0.005 TYP .
0.06 L A S B S
34.5
1
20x 0.5 ± 0.03
10.53
41.3
42.3
0.06 L A S B S
11.93
PIN 1
2.5
10
10
3x
7.2
10
3x
LEGEND
1. PADS AND VIAS ARE CHASSIS GROUND
2. THR OUGH HOLES, PLATING OPTIONAL
3. HATCHED AREA DENOTES COMPONENT
4. AREA DENOTES COMPONENT
DIMENSIONS ARE IN MILLIMETERS
AND TRACE KEEPOUT (EXCEPT
CHASSIS GROUND)
KEEPOUT (TRACES ALLOWED)
5
20
11
7.1
2.5
11x 2.0
2x 1.7
3.68
8.48
∅ 0.85 ± 0.05
9x 0.95 ± 0.05
A
SEE DET AIL 1
∅ 0.1 S X Y
∅ 0.1 L X A S
4.8
1
9.6
2
11.93