HFBR-1528Z Avago Technologies US Inc., HFBR-1528Z Datasheet - Page 4

• Manufacturer Part Number: HFBR-1528Z
• Description: XMITTER FIBER OPTIC 600NM 10MBD
• Manufacturer: Avago Technologies US Inc.

Specifications of HFBR-1528Z

• Wavelength: 600nm
• Voltage - Forward (vf) Typ: 2.02V
• Current - Dc Forward (if): 1A
• Voltage - Dc Reverse (vr) (max): 5V
• Connector Type: Versatile Link
• Function: Ideal for solving problems with voltage isolation/insulation, EMI/RFI immunity or data security.
• Product: Transmitter
• Data Rate: 10 MBd
• Diode Capacitance: 60 pF
• Maximum Rise Time: 13 ns (Typ)
• Maximum Fall Time: 10 ns (Typ)
• Operating Supply Voltage: 4.75 V to 5.25 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Data Rate Max: 10Mbps
• Forward Current If: 80mA
• Forward Voltage: 1.67V
• Reverse Voltage Vr: 5V
• Data Transmission Distance: 50ft
• Wavelength Typ: 660nm
• Msl: MSL 4 - 72 Hours
• Fiber Material: Plastic
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Capacitance: -
• Spectral Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With: Plastic Optical Fiber, Hard Clad Silica
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-2047

Versatile Link Printed Board Layout Dimensions
Horizontal Module
Interlocked (Stacked) Assemblies
(refer to Figure 1)
Horizontal packages may be
stacked by placing units with pins
facing upward. Initially engage
the interlocking mechanism by
sliding the L bracket body from
above into the L slot body of the
lower package. Use a straight
edge, such as a ruler, to bring all
Stacking Horizontal Modules
Figure 1. Interlocked (stacked) horizontal or vertical packages.
4
TOP VIEW
(0.100)
DIMENSIONS IN MILLIMETERS (INCHES).
2.54
4
5
3
2
1
6
(0.300)
7.62
(0.073)
1.85
1.01 (0.040) DIA.
MIN.
(0.300)
7.62
PCB EDGE
stacked units into uniform
alignment. This technique
prevents potential harm that
could occur to fingers and hands
of assemblers from the package
pins. Stacked horizontal packages
can be disengaged if necessary.
Repeated stacking and unstacking
causes no damage to individual
units.
Stacking Vertical Modules
Vertical Module