VSMF3710-GS08 Vishay, VSMF3710-GS08 Datasheet - Page 4

• Manufacturer Part Number: VSMF3710-GS08
• Description: EMITTER IR PLCC-2 HI SPD 890NM
• Manufacturer: Vishay

Specifications of VSMF3710-GS08

• Rise Time: 30 ns
• Radiant Intensity: 10 mW/sr
• Viewing Angle: 120°
• Current - Dc Forward (if): 100mA
• Radiant Intensity (ie) Min @ If: 6mW/sr @100mA
• Wavelength: 890nm
• Voltage - Forward (vf) Typ: 1.6V
• Orientation: Top View
• Mounting Type: Surface Mount
• Package / Case: PLCC-2
• Beam Angle: 60 deg
• Maximum Forward Current: 100 mA
• Maximum Power Dissipation: 170 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Fall Time: 30 ns
• Forward Current: 100 mA
• Forward Voltage: 1.4 V
• Lens Shape: Circular
• Mounting Style: SMD/SMT
• Peak Wavelength: 890nm
• Forward Current If(av): 100mA
• Fall Time Tf: 30ns
• Supply Voltage Range: 1.4V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 751-1253-2

VSMF3710
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
SOLDER PROFILE
www.vishay.com
4
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
19841
300
250
200
150
100
50
0
0
Drawing-No.: 6.541-5067.01-4
Issue: 5; 04.11.08
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
20541
50
C
max. 120 s
100
Time (s)
150
3
For technical questions, contact:
Pin identification
3.5
Ø 2.4
+ 0.15
max. 100 s
max. 30 s
200
± 0.2
High Speed Infrared Emitting Diode,
max. 260 °C
250
890 nm, GaAlAs Double Hetero
245 °C
300
A
[e-mail]
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: T
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
1.6 (1.9)
Mounting Pad Layout
amb
< 30 °C, RH < 60 %
technical drawings
according to DIN
specifications
1.2
4
area covered with
solder resist
Document Number: 81241
Rev. 1.7, 03-Nov-09