C8051T606ZDB Silicon Laboratories Inc, C8051T606ZDB Datasheet - Page 22
C8051T606ZDB
Manufacturer Part Number
C8051T606ZDB
Description
CARD DAUGHTER QFN10 SOCKET
Manufacturer
Silicon Laboratories Inc
Datasheets
1.C8051T600EDB.pdf
(188 pages)
2.C8051T606TDB.pdf
(1 pages)
3.C8051T606TDB.pdf
(14 pages)
Specifications of C8051T606ZDB
Module/board Type
Socket Module - QFN
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
C8051T606
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1668
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C8051T600/1/2/3/4/5/6
4. QFN-11 Package Specifications
22
Notes:
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-243, variation VEED except for
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
A1
A3
D2
D
A
b
e
custom features D2, E2, and L which are toleranced per supplier designation.
Components.
0.80
0.03
0.18
1.30
Min
Table 4.1. QFN-11 Package Dimensions
Figure 4.1. QFN-11 Package Drawing
0.25 REF
3.00 BSC
0.50 BSC
Nom
0.90
0.07
0.25
1.35
Max
1.00
0.11
0.30
1.40
Rev. 1.2
Dimension
aaa
bbb
ddd
eee
E2
E
L
2.20
0.45
Min
—
—
—
—
3.00 BSC
Nom
2.25
0.55
—
—
—
—
Max
2.30
0.65
0.15
0.15
0.05
0.08
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